Basics, Flexible Hybrid Electronics & Lab to Fab
Mark D. Poliks is a Professor of Systems Science and Industrial Engineering and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. He is an expert in electronics packaging, flexible electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He has authored numerous technical papers and invited presentations. He holds over forty US patents.
Poliks is active in the leadership of the IEEE/CPMT Electronic Components and Technology Conference (ECTC) serving as chair of several technical program sub-committees. He chaired the 2010 ECTC plenary session on "The Evolution of Mobile Processing Architectures" and was a symposium organizer of "Roll-to-Roll Processing of Electronics and Advanced Functionalities" at the 2012 fall meeting of the Materials Research Society.
He has held senior technical management positions at Endicott Interconnect Technologies, Inc. and IBM Microelectronics. He was a founding member of the IBM Materials Research Community and received an IBM award for "Excellence in Technical Management." Poliks received his Ph.D. in materials science and engineering from the University of Connecticut and held a McDonnell-Douglas postdoctoral fellowship at Washington University in St. Louis.
|James J. Watkins|
University of Massachusetts, Amherst
James Watkins is Professor of Polymer Science and Engineering and Director of the Center for Hierarchical Manufacturing, a National Science Foundation Nanoscale Science and Engineering Center (NSEC) at the University of Massachusetts, Amherst. Professor Watkins received his B.S. and M.S. degrees in Chemical Engineering from the John Hopkins University and his Ph.D. in Polymer Science and Engineering from the University of Massachusetts. He joined the Chemical Engineering faculty at UMass in 1996 and the Polymer Science and Engineering faculty in 2005. He is the recipient of a Camille Dreyfus Teacher-Scholar Award and a David and Lucile Packard Foundation Fellowship for Science and Engineering and is a fellow of the American Physical Society.
|Michael A. Mastropietro|
Mike Mastropietro is part of NextFlex’s technology commercialization team whose goal is to demonstrate scalable additive manufacturing of flexible, stretchable, and 3D hybrid electronics and devices. He manages the conventional and direct write printing equipment installed in the institute’s cleanroom and the process development work on these systems. Previously he worked at NovaCentrix after their acquisition of his company, PChem Associates Inc. As co-founder and chief-technologist of PChem he spent a decade developing, patenting, and commercializing nanoparticle based inks, additive circuit manufacturing processes, and printed devices and electronics. He started his career at Parelec Inc., pioneers of next generation hybrid particle-metalorganic decomposition (MOD) based functional inks.
He has expertise in chemical precipitation synthesis of metallic nanoparticles, colloid stabilization methods, and formulation of printable functional ‘inks’ for electronics applications. He is proficient in conventional and direct write printing methods, flash lamp curing, and other processing technologies for additive manufacture of 2D flexible and 3D hybrid electronics.
Mastropietro holds a M.S degree in chemical engineering from The Pennsylvania State University. His research on synthesis of surfactant stabilized nanoparticles was awarded a 2000 Materials Research Institute Xerox Research Award.