2018FLEX Call For Papers

 Co-located with:



Note: FlexTech is pleased to announce that a generous donation by Lockheed Martin will be used to underwrite student travel expenses for whose posters abstracts are accepted for presentation at 2018FLEX. Therefore, we are extending Student Posters Abstract Submission period to January 15, 2018

Student Travel Scholarship Sponsored by: 

Call for Abstracts & Posters

FlexTech, NextFlex, SEMI and the 2018FLEX Executive Committee invite you to submit an abstract of a paper, student poster or industry poster for the 17th Annual Flexible and Printed Electronics Conference - www.2018FLEX.com. The annual event highlights the latest technical breakthroughs and demonstrations of flexible hybrid and printed electronics products, equipment, processes and materials and the applications they enable.

This year's theme is From Materials to Markets

The city of Monterey, California hosts 2018FLEX, which brings together world leaders in flexible and printed electronics in an environment conducive to formal and informal information-exchange, networking, and business collaboration. The event attracts technical representatives from over 400 companies, universities, R&D labs, and government agencies from around the world. 

Students from leading research universities are especially welcome to submit posters describing their work and results on the same target topics. Prizes are awarded to the top three student posters as judged by a panel of industry and academic experts. The author/co-author must be available to present during the poster judging times.


Deadline for Abstracts:
November 3, 2017

Notification of Acceptance:
November 22, 2017

Final Presentation Due:
February 1, 2018

How to Submit an Abstract

To submit an abstract for a conference paper or student poster, go to https://www.surveymonkey.com/r/KBQ6DKR. Complete the online form with your contact information and upload an abstract of 100-250 words clearly describing the technical breakthrough or discovery that will be presented and how it applies to flexible and printed electronics products. Papers will be grouped with similar papers to create topical tracks for like-minded attendees.

Preference will be given to original research and advancements in process and materials, to end users, potential end users and to presentations who commit to demonstrations at FLEXTalk inside the Exhibit Hall.  

2018FLEX is a technical conference and abstracts should be prepared for a technical audience who wish to hear relevant, scientific data on notable breakthroughs. Abstracts focused only on promoting new products or services, without consideration to the problem solved and science behind the concept, will not be accepted. Abstracts should not contain tables, charts or pictures. SEMI, FlexTech and NextFlex members will receive priority consideration. 


Benefits of Presenting

Be recognized as a leader in this exciting and market-disrupting field of electronics. Selected presenters will receive acknowledgement in the 2018FLEX program guide, on the conference website and in the conference proceedings. Speakers also receive a significantly discounted conference registration fee along with an opportunity to demo their product/material/small equipment at FLEXTalk inside the Exhibit Hall. 

Call for Abstracts - Topic Areas*

Strategy & Business

  • Road Maps for Flexible Printed & Hybrid Electronics
  • Strategies for Bringing Products to Market
  • National Program Overviews (worldwide)
  • Success Stories, including Partner Strategies
  • Design to Manufacturing Challenges
  • Supply Chain Ownership Models
  • Pilot line Manufacturing Case Studies
  • Technical Gaps Analysis
  • Integration Strategies

End Market Requirements & Case Studies 

  • Aircraft & Automotive
  • Consumer Electronics and Appliances
  • Medical Monitoring
  • Performance Monitoring
  • Wearables and Textiles
  • Environmental Monitoring & Sensing
  • Smart Buildings
  • Structural Health Monitoring
  • Agriculture
  • Packaging, Smart Labels and Retail
  • Security and Asset Monitoring
  • Smart Surfaces & Lighting
  • Solar & Photovoltaic

Flexible Electrical Components

  • TFTs, Memory and Logic
  • Sensors
  • Software, Analytics & Machine Learning
  • Flexible Displays
  • Batteries and Energy Sources
  • Membrane Switches
  • Hybrid Devices
  • MEMS
  • RFID, NFC, other Communication Components
  • Antennas
  • Touch Technology
  • Solid State Lighting and OLEDs


  • Nonmenclature
  • Design and Modeling Software
  • Process & Manufacturing
  • Materials & Substrates

Processes and Manufacturing

  • Integrated Manufacturing
  • Additive (3D) Printing
  • Hybrid Printing Processes
  • Roll to Roll and Web Processing
  • Deposition Techniques and Equipment 
  • Imprint Lithography
  • Integration of Hybrid Devices
  • System Interconnects
  • Component Interconnects
  • Metrology
  • Pick & Place Tools & Strategies
  • Tooling Strategies
  • Testing
  • Failure & Lifetime Reliability
  • Repeatability
  • Recycling & Disposal


  • Substrates and Substrate Treatments
  • Conductors, Insulators, Semiconductors
  • Functional Inks
  • Nanomaterials and Graphene
  • Bio-markers & Recognition Elements
  • Adhesives and Encapsulants
  • ITO and ITO Replacements 
  • Sustainable Materials
  • Bio-compatible Materials
  • Barrier Films
  • Electronic Fibers and Fabrics


  • Smart Manufacturing 
  • Smart MedTech
  • IoT
  • Smart Transportation

*abstracts on topics not included in this list will be reviewed for applicability 






Download Call for Abstracts PDF