2018FLEX - Agenda

 

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2018FLEX Agenda

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Access the agenda by day: MONDAY, 2/12/18   TUESDAY, 2/13/18  |  WEDNESDAY, 2/14/18  |  THURSDAY, 2/15/18  |  FLEXTalk

Concurrent Tech Events: FLEXTalk  STUDENT POSTERS

MONDAY, FEBRUARY 12, 2018 (COURSES & DISCUSSIONS)
 7:00 AM REGISTRATION OPENS 
 

9:00 AM - 12:00 PM
 

 

 

 

SHORT COURSE 1: Basics, Flexible Hybrid Electronics & Lab to Fab





 
Mark Poliks, Professor of Systems Science & Industrial Engineering, Technical Director of CAMM, Binghamton University
James J. Watkins, Professor of Polymer Science & Engineering, Director of the Center for Hierarchical Manufacturing, NSEC, University of Massachusetts, Amherst
Mike Mastropietro, Sr. Engineering Manager of Printing & Additive Processing, NextFlex
 1:00 PM - 4:00 PM
 
SHORT COURSE 2: Challenges and Solutions for Integration of Sensors with Flexible, Hybrid, Printed SystemsChip Spangler, President, Aspen Microsystems
Mary Ann Maher, CEO, SoftMEMS
 

1:00 PM - 4:00 PM


 

SHORT COURSE 3: Flexible Device Integration & Packaging


 
Pradeep Lall, MacFarlane Endowed Professor of Mechanical Engineering, Director of Harsh Environment Node of NextFlex, Director of NSF-CAVE3 Electronics Research CenterAuburn University
 1:00 PM - 4:00 PM



 
SHORT COURSE 4: Next Generation of Flexible Displays



 

Paul Cain, Strategy Director, FlexEnable
Mike Hack, VP of Business Development, Universal Displays
Erica Montbach, Research and Development Manager, Kent Displays
E Ink

 4:00 PM - 5:30 PM




 
Applications Panel Discussion (Open to All)





 
Panelists:
Nancy Stoffel, Horizontal Leader-Flexible Hybrid Electronics, GE Global Research 
Jeff Spindler, Director of Product Commercialization, OLEDWorks LLC
Al Compaan, President & CTO, Lucintech
Tatsuo Ogawa, Director of Groupwide CTO Office, Panasonic
 5:30 PM - 6:30 PMWELCOME RECEPTION 
TUESDAY, FEBRUARY 13, 2018
  7:00 AM REGISTRATION OPENS & BREAKFAST 
1A8:00 AM - 9:45 AMPLENARY 1:  APPLICATIONS & MARKETS I
1.1A8:00 AM2018FLEX Introduction & WelcomeAjit Manocha
President & CEO
SEMI
1.2 A8:20 AM

TOPIC: Market Data Talk

  
1.3A8:45 AMTOPIC: Flexible Sensors in the BrainRikky Muller
Co-Founder & CTO
Cortera Neurotechnologies
1.4A9:10 AMTOPIC: Device Power (Batteries)Tatsuo Ogawa
Director, Planning Center
Panasonic
1.5A9:35 AMSponsored by: 
FLEXI Awards Ceremony
  
  9:45 AMMORNING BREAK  
2A10:45 AM - 12:25 PMPLENARY 2: APPLICATIONS & MARKETS II
2.1A10:45 AMTOPIC: Manufacturing in Space:  The first 3D Printer to Manufacture Parts in SpaceMeyya Meyyappan
Chief Scientist for Exploration Technology
NASA
2.2A11:10 AMTOPIC: Human Interface with Technology: Heads Up Display, Automobile Displays, Cockpit DistractionsSeth Coe Sullivan
VP & CTO
Luminit
2.3A11:35 AMTOPIC: Collaboration on Flexible Drone/UAV Platform Using Novel Inks and Printed Processes

Gregory Fritz
Materials Scientist

Draper Lab
2.4A12:00 PMTOPIC: Commercializing Flexible ElectronicsPeter Fischer
COO
Thin Film Electronics
  12:25 PMLUNCH 
3A1:55 PM - 4:00 PMSESSION 3: START-UP BUSINESS STRATEGIES (TBA)
      
  4:00 PM - 6:00 PMNETWORKING RECEPTION
4B1:55 PM - 4:00 PMSESSION 4: DISPLAYS
4.1B1:55 PMTBA  
4.2B2:20 PMOrganic Vapor Jet Printing: a Solvent-Less, Mask-Less Patterning Technology for OLED DisplaysMike Hack
VP of Business Development
Universal Display Corporation
4.3B2:45 PMPolyfluorinated Electrolyte for Fully Printed Carbon Nanotube ElectronicsHuaping Li
Chief Scientist
Atom Optoelectronics
4.4B3:10 PMTBA  
4.5B3:35 PMTBA  
  4:00 PM - 6:00 PMNETWORKING RECEPTION
WEDNESDAY, FEBRUARY 14, 2018
  7:00 AMWOMEN IN TECH BREAKFAST 
  7:00 AM REGISTRATION OPENS & BREAKFAST 
5A8:00 AM - 9:25 AMSESSION 5: HEALTH MONITORS 
5.1A8:00 AMWearable Patch for Continuous Monitoring of Sweat ElectrolytesAzar Alizadeh
Senior Material Scientist
GE Global Research
5.2A8:25 AMFlexible Oral Biosensing PlatformDavid Schwartz
Area Manager
PARC, a Xerox Company
5.3A8:45 AMGraphene-based sensor for preventative diabetic healthcareLinh Le
CEO
Bonbouton
5.4A9:05 AMLow-Power Wearable Sensors Enabled by Large-Area Flexible Organic PhotodiodesCanek Fuentes-Hernandez
Senior Research Scientist
Georgia Institute of Technology
  9:25 AMMORNING BREAK 
6B8:00 AM - 9:25 AMSESSION 6: RF & SECURITY
6.1B8:00 AMOperationalizing Printed Electronics & Additive Manufacturing to Enhance Warfighter Capabilities and Strengthen the Organic Industrial BaseJames Zunino
ARDEC AM Principal/Materials Engineer
US Army RDECOM-ARDEC
6.2B8:25 AMSurface Agnostic Conformable Antenna ArraysJohn Rogers
Electrophysics Engineer
Boeing Research & Technology
6.3B8:45 AMCopper Micro-Wires for RF ApplicationsCarolyn Ellinger
Senior Research Scientist
Eastman Kodak Company
6.4B9:05 AMTBA  
  9:25 AMMORNING BREAK 
7A10:25 AM - 11:50 AMSESSION 7: HEALTH MONITORING SYSTEMS
7.1A10:25 AMFlexible Hybrid Systems for the IOTJanos Veres
Program Manager
PARC, a Xerox Company
7.2A10:50 AMDevelopment of Flexible Biometric Sensor Band with Lifesave App and Test ProtocolsPradeep Lall
MacFarlane Endowed Professor & Director
Auburn University
7.3A11:10 AMWearable Sensing Gloves for Objective Medical AssessmentsMoran Amit
Post-Doctoral Fellow
University of California, San Diego
7.4A11:30 AMDesign Considerations for Biomedical Applications Using Thin-Film Tactile Force SensorsRob Podoloff
CTO
Tekscan, Inc
  11:50 AMLUNCH 
8B10:25 AM - 11:50 AMSESSION 8: DIRECT WRITE & 3D PRINTING I
8.1B10:25 AMToward the Fabrication of Electronic Circuits without using Surface Mounted ComponentsDaniel Hines
Scientist
Laboratory for Physical Sciences
8.2B10:50 AM3D Printing of Polymer-Bonded Magnets Using a Combination of Extrusion Direct Write and Stereolithography MethodsCallum Bailey
Research Engineer
United Technologies Research Center
8.3B11:10 AMAerosol Jet Printed Carbon-Nanotube-Network Thin-Film-Transistors on Flexible SubstratesJialuo Chen
PhD Student
Georgia Institute of Technology
8.411:30 AMElectromagnetic Shielding of Flexible DevicesKurt Christenson
Senior Scientist
Optomec
  11:50 AMLUNCH

 

9A1:30 PM - 2:55 PMSESSION 9: FLEXIBLE ELECTRONICS APPLICATIONS I
9.1A1:30 PMComplex Flexible Hybrid Electronic LabelsDouglas Hackler
President & CEO
American Semiconductor
9.2A1:55 PMFHE System for Touch and GestureRichard Ellinger
VP of Sales & Marketing
American Semiconductor
9.3A2:15 PMEnergy Efficient Polymeric Window and DisplayJosh Finch
Project Engineer
New Visual Media Group, LLC
9.4A2:35 PMThe Flexible Electronics behind the Graftworx SmartPatchAnthony Flannery
VP of Engineering
Graftworx
  2:55 PMAFTERNOON BREAK 
10B1:30 PM - 2:55 PMSESSION 10: DIRECT WRITE & 3D PRINTING II
10.1B1:30 PMChallenges and Opportunities for 3D Printed ElectronicsJan Vardaman
President
TechSearch International, Inc. 
10.2B1:55 PMInkjet printed multilayer circuit: materials and design considerationsEmmanuel Van Kerschaver
Application Engineer
Meyer Burger Technical Systems (MBTS)
10.3B2:15 PMPrinted Electronics Using Magnetohydrodynamic Droplet Jetting of Molten Aluminum and CopperDenis Cormier
Earl W. Brinkman Professor, AMPrint Center Director
Rochester Institute of Technology
10.4B2:35 PMPrinted wireless sensor demonstrationKenneth Church
CEO
nScrypt, Inc. 
  2:55 PMAFTERNOON BREAK 
11A3:55 PM - 5:40 PMSESSION 11: FLEXIBLE ELECTRONICS APPLICATIONS II
11.1A3:55 PMPerovskite solar cells on flexible glassMaikel van Hest
Senior Scientist
National Renewable Energy Laboratory
11.2A4:20 PMAll-solution-processed ferroelectric capacitors for flexible non-volatile memory applications: processing conditions and short circuitsYanguang Zhang
Research Officer
National Research Council Canada
11.3A4:40 PMNovel Materials for Fabrication of Photovoltaic and Optical Devices Fully Fabricated In AirBill Babe
Sales & Marketing Manager
Liquid X Printed Metals
11.4A5:00 PMInkjet-Printing of Optoelectronics SensorsMartin Bolduc
Senior Researcher
INO - National Optics Institute
11.5A5:20 PMTBA  
12B3:55 PM - 5:40 PMSESSION 12: FE TOOLS & METHODS 
12.1B3:55 PMModular R2R Vacuum Coating System Platform for Pilot Scale Development and ProductionMichael Simmons
President
Intellivation
12.2B4:20 PMApplication of high-rate PECVD for improved mechanical stability of Roll-to-roll manufactured flexible organic electronics.Michiel Top
Research PhD Student
Fraunhofer FEP
12.3B4:40 PMDevelopment of a fully Integrated, Compatible, Materials Stack for Flexible Printed ElectronicsRahul Raut
Director, Strategy & Technology Acquisition
Alpha Assembly Solutions
12.4B5:00 PMTemporary bonding layers for plastic-based microfabrication of flexible displaysDavid Arreaga
CEO
Ares Materials
12.5B5:20 PMTBA  
THURSDAY, FEBRUARY 15, 2018
  7:00 AMREGISTRATION OPENS & BREAKFAST 
13A8:00 AM - 9:45 AMSESSION 13: EMERGING CAPABILITIES 
13.1A8:00 AMA Holistic Approach to Thermal Management in Flexible / Hybrid Electronics Using Carbon Fiber TechnologyMP Divakar
CEO
Stack Design Automation
13.2A8:25 AMGame Changers: How multifunctional substrate and fibers enable NextFlex and AFFOAJoey Mead
Professor, Department of Plastics Engineering
University of Massachusetts, Lowell
13.3A8:45 AMA Holistic Approach Towards Flexible Hybrid Integration for Large-Area Sensor Platforms by System Design and DemonstrationsJames Sturm
Professor
Princeton University
13.4A9:05 AMFPD production of flexible oxide TFT circuits on GEN2 substrateBoris Galkin
Business Development Director
TENFLECS
13.5A9:25 AMPhotonic Annealing of Perovskite Thin FilmsThad Druffle
Theme Leader Solar Manufacturing R&D
University of Louisville
  9:45 AMMORNING BREAK 
14B8:00 AM - 9:45 AMSESSION 14: STANDARDS & RELIABILITY
14.1B8:00 AMIPC - Printed Electronics Design Standards UpdateNeil Bolding
Technical Manager
MacDermid Performance Solutions
14.2B8:25 AMTest Protocols Development for the Flexible Substrates in Wearable ApplicationsPradeep Lall
MacFarlane Endowed Professor & Director
Auburn University
14.3B8:45 AMStretch Testing of Flexible ElectronicsJustin Chow
Graduate Student
Georgia Institute of Technology
14.4B9:05 AMStretching Testing Method for Flexible Hybrid ElectronicsNaotsugu Ando
Chief
YUASA SYSTEM
14.5B9:25 AMEnabling fleet analytics to optimize productionDoug Suerich
Product Evangelist
The PEER Group Inc. 
  9:45 AMMORNING BREAK 
15C8:00 AM - 9:45 AMSESSION 15: FLEXIBLE ELECTRONICS MANUFACTURING
15.1C8:00 AMIntegration of Emerging and Evolving Technologies to Create Novel ProductsJohn Heitzinger
Director of Strategic Partnerships
Interlink Electronics
15.2C8:25 AMMultek Industry 4.0 StrategyBrendan Nagle
R&D Engineer
Multek
15.3C8:45 AMQRC Printed Hybrid ElectronicsKevin Rose
Director of Business Development
Fourth Dimension Engineering
15.4C9:05 AMFeatures of the Future: The Path to High-Throughput Flexible Hybrid ElectronicsPeter Hessney
President
Sensor Films Inc. 
15.5C9:25 AMEvaluation of 3D Molded Interconnected DeviceOffir Duman
Project Manager & System Engineer
Flex
  9:45 AMMORNING BREAK 
16A10:15 AM - 12:00 PMSESSION 16: SENSORS & POWER
16.1A10:15 AMSystem Design for Flexible All-Organic Reflectance OximeterAna Claudia Arias
Professor
University of California, Berkeley
16.2A10:40 AMCarbon Nanotubes: Sensors and Other UsesRobert Praino
COO & Co-Founder
Chasm Technologies Inc. 
16.3A11:00 AMUltra-Thin, solid-state rechargeable battery with vertically integrated solar cellBrian Berland
Chief Science Officer
ITN Energy Systems
16.4A11:20 AMUltra-light-weight, thin-film CdTe PV minimodules on flexible ceramicVictor Plotnikov
Principal Scientist
Lucintech Inc. 
16.5A11:40 AMTBA  
  12:00 PM

                                                                         Presented by:
LUNCH & STUDENT POSTER AWARDS - 

 
17B10:15 AM - 12:00 PMSESSION 17: SUBSTRATES
17.1B10:15 AMFlexible Glass Applications & Process ScalingSean Garner
Senior Research Associate
Corning Incorporated
17.2B10:40 AMRefinement of transparent conductive films on flexible glass by in-line flash lamp annealingManuela Junghaehnel
Group Leader S2S Technologies & Coordinator Flexible Glass Activities
Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
17.3B11:00 AMPolyester Film Substrates for Flexible and Formable ElectronicsScott Gordon
New Business Development Manager
DuPont Teijin Films
17.4B11:20 AMMulti-Material Ribbon Ceramic Supply Chain to Product Application Roadmap for FHEJohn Olenick
President
ENrG Incorporated
17.5B11:40 AMPolysulfide elastomers for use in flexible and stretchable electronicsRadu Reit
CTO
Ares Materials
  12:00 PM                                                                         Presented by: 
LUNCH & STUDENT POSTER AWARDS - 
 
18C10:15 AM - 12:00 PMSESSION 18: FHE CHIP INTEGRATION
18.1C10:15 AMInvestigation of Ultrathin/High IO Die Attach to Flexible SubstratesMichael Santos
Advanced Technology Engineer
Jabil
18.2C10:40 AMFlexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-based InterconnectsAmir Hanna
Postdoctoral Scholar
University of California, Los Angeles
18.3C11:00 AMPhotonic Soldering to Enhance Manufacturability of Wearable TechnologyVahid Akhavan
Senior Application Engineer
NovaCentrix
18.4C11:20 AMLow Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT eraHiroshi Komatsu
Director
CONNECTEC Japan Corporation
18.5C11:40 AMJoining to Temperature Sensitive Substrates with Asymmetric HeatingPeter McClure
Process Research Engineer
Universal Instruments Corporation
  12:00 PM                                                                        Presented by:
LUNCH & STUDENT POSTER AWARDS - 
 
19A1:40 PM - 3:25 PMSESSION 19: CONDUCTORS 
19.1A1:40 PMNovel Low Temperature Materials as Key Enablers of Flexible Hybrid ElectronicsBawa Singh
Executive VP of Technology & Corporate Development
Alpha Assembly Solutions
19.2A2:05 PMVersatile Molecular Silver Ink Platforms for Printed ElectronicsArnold Kell
Senior Research Officer
National Research Council Canada
19.3A2:25 PMPhotonic sintering of micron particle conductive pasteHarvey Tsang
Electronics Engineer
Army Research Labs
19.4A2:45 PMAnisotropic Conductive Adhesives on Flexible Hybrid ElectronicsAngel Rodriguez
Undergraduate Student Researcher
Boise State University
19.5A3:05 PMDesign, Fabrication and Testing of High Resolution Aerospace Wear SensorAlan Shen
Ph.D. Student
University of Connecticut
   ADJOURN
20B1:40 PM - 3:25 PMSESSION 20: TBA
      
   ADJOURN
21C1:40 PM - 3:25 PMSESSION 21: PROCESS CONTROL
21.1C1:40 PMProcess Stackup Software for Multilayer PrintingKalsi Kwan
Electrophysics Process Engineer
Boeing Research & Technology
21.2C2:05 PMOn-Line Defect Detection in Micro-GridsTimothy Potts
President
Dark Field Technologies, Inc.
21.3C2:25 PMNon-Contact Stress Metrology for Flexible ElectronicsWojtek Walecki
CTO
Frontier Semiconductor
21.4C2:45 PMDirect digital manufacturing of human temperature monitoring device using flip chip method into silicone encapsulantSami Hawasli
Electrical Engineer
Army Research Laboratory
21.5C3:05 PMTBA  
   ADJOURN

For the MEMS & Sensors Technical Congress agenda, please visit: http://www.semi.org/en/mstc2018agenda

Last Updated: 12/14/2017 10:17 PM PST