2018FLEX - Agenda

 

 Co-located with:

2018FLEX Agenda

Agenda is subject to change. Please check back for updates.
 

Access the agenda by day: MONDAY, 2/12/18   TUESDAY, 2/13/18  |  WEDNESDAY, 2/14/18  |  THURSDAY, 2/15/18  

Concurrent Tech Events: FLEXTalk  STUDENT POSTERS

MONDAY, FEBRUARY 12, 2018 (COURSES & DISCUSSIONS)
 7:00 AM REGISTRATION OPENS 
 

9:00 AM - 12:00 PM
 

 

 

 

SHORT COURSE 1: From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics





 
Mark Poliks, Professor of Systems Science & Industrial Engineering, Technical Director of CAMM, Binghamton University
James J. Watkins, Professor of Polymer Science & Engineering, Director of the Center for Hierarchical Manufacturing, NSEC, University of Massachusetts, Amherst
Mike Mastropietro, Sr. Engineering Manager of Printing & Additive Processing, NextFlex
 1:00 PM - 4:00 PM
 
SHORT COURSE 2: Challenges and Solutions for Integration of Sensors with Flexible, Hybrid, Printed SystemsChip Spangler, President, Aspen Microsystems
Mary Ann Maher, CEO, SoftMEMS
 

1:00 PM - 4:00 PM



 

SHORT COURSE 3: Flexible Device Integration & Packaging

 


 

Pradeep Lall, MacFarlane Endowed Professor of Mechanical Engineering, Director of Harsh Environment Node of NextFlex, Director of NSF-CAVE3 Electronics Research CenterAuburn University
Douglas Hackler, President & CEO, American Semiconductor
Kurt Christenson, Senior Scientist, Optomec
 1:00 PM - 4:00 PM



 
SHORT COURSE 4: Next Generation Flexible Displays



 

Paul Cain, Strategy Director, FlexEnable
Mike Hack, VP of Business Development, Universal Displays
Erica Montbach, Manager for R&D, Kent Displays
D. Scott Bull, AVP of Research, E Ink

 4:00 PM - 5:30 PM







 
Applications Panel Discussion (Open to All)







 
Moderator: Malcolm Thompson, Executive Director, NextFlex
Panelists: Nancy Stoffel, Horizontal Leader-Flexible Hybrid Electronics, GE Global Research 
Jeffrey Spindler, Director of Product Commercialization, OLEDWorks LLC
Al Compaan, President & CTO, Lucintech
Tatsuo Ogawa, Director, Manufacturing Technology & Engineering, Panasonic
Wolfgang Juchmann, VP of Sales & Business Development, AutonomouStuff, Inc
 5:30 PM - 6:30 PMWELCOME RECEPTION 
TUESDAY, FEBRUARY 13, 2018
  7:00 AM REGISTRATION OPENS & BREAKFAST  - Sponsored by 
1A8:00 AM - 9:45 AMPLENARY 1:  APPLICATIONS & MARKETS I
1.1A8:00 AM2018FLEX Introduction & WelcomeAjit Manocha
President & CEO
SEMI
1.2 A8:20 AM

Market Opportunity for Flexible Displays

Paul Gagnon
Executive Director, Research and Analysis
IHS Markit
1.3A8:45 AMMinimally Invasive Wireless Neural InterfacesRikky Muller
Co-Founder & CTO
Cortera Neurotechnologies
1.4A9:10 AMMarket and Technology overview of Li-ion BatteryTatsuo Ogawa
Director, Manufacturing Technology & Engineering
Panasonic
1.5A9:35 AMSponsored by: 
FLEXI Awards Ceremony
  
  9:45 AMMORNING BREAK - Sponsored by  
2A10:45 AM - 12:25 PMPLENARY 2: APPLICATIONS & MARKETS II
2.1A10:45 AMIn-Space Manufacturing: A Multimaterial Fab Lab for the International Space StationMeyya Meyyappan
Chief Scientist for Exploration Technology
NASA Ames Research Center
2.2A11:10 AMAutomotive Reality Head-Up Displays in the Era of Driverless CarsSeth Coe Sullivan
VP & CTO
Luminit
2.3A11:35 AMEnabling Printed Power Electronics through Collaboration

Greg Fritz
Materials Scientist

Draper
2.4A12:00 PMRoll-to-Roll based Manufacturing Innovations to scale Printed Electronics to the Billion of Units enabling the Internet of ThingPeter Fischer
COO
Thin Film Electronics
  12:25 PMLUNCH - Sponsored by  
3A1:55 PM - 4:05 PMSESSION 3: START-UP BUSINESS STRATEGIES 
3.1A1:55 PMTBA 
3.2A2:15 PMInnovation at Risk: The Industry Talent ChallengeJonathan Davis
VP of Global Advocacy
SEMI
3.3A2:35 PMA Discussion with Oshri Kaplan: A Technology VC PerspectiveModerator: Melissa Grupen-Shemansky, CTO, SEMI-FlexTech
Speaker: Oshri Kaplan, Partner, Silicon Foundry

3.4

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

3:05 PM

 

 

 

 

 

 

 

Panel Discussion: Identifying Opportunities for Small Businesses to Partner with the DoD in FHE Innovations

 

 

 

 

 

 

 

Moderator: Joseph Kunze, President & CEO, SI2 Technologies
Panelists: Jason Jouet, Deputy Director, Manufacturing Technology, Office of Secretary of Defense Manufacturing & Industrial Base Policy
James Zunino, Project Officer, Army Armament Research, Development, & Engineering Center
Christian Whitchurch, Chief Scientist, Defense Threat Reduction Agency J9-CBA
James Christensen, Airman Sensing & Assessment Portfolio Manager, Air Force Research Laboratory Airman Systems Directorate
Kevin Kluska, Program Lead for Tailored Solutions, U.S. Government
  4:05 PM - 6:05 PMNETWORKING RECEPTION
4B1:55 PM - 4:00 PMSESSION 4: DISPLAYS
4.1B1:55 PMFlexible Display Market Outlook, Challenges and OpportunitiesRoss Young
CEO
Display Supply Chain Consultants (DSCC)
4.2B2:20 PMOrganic Vapor Jet Printing: a Solvent-Less, Mask-Less Patterning Technology for OLED DisplaysMike Hack
VP of Business Development
Universal Display Corporation
4.3B2:45 PMePaper 2.0– Enabling Applications Where Displays Haven’t Succeeded BeforeFrank Christiaens
Chairman & CEO
CLEARInk Displays
4.4B3:10 PMPolyfluorinated Electrolyte for Fully Printed Carbon Nanotube ElectronicsHuaping Li
Chief Scientist
Atom Optoelectronics
4.5B3:35 PMNext Generation Flexible eWriters - Transition from Research of New Technologies to Roll-to-Roll Manufacturing Asad Khan
CTO
Kent Displays
  4:00 PM - 6:00 PMNETWORKING RECEPTION
WEDNESDAY, FEBRUARY 14, 2018
  7:00 AMWOMEN IN TECH BREAKFAST 
  7:00 AM REGISTRATION OPENS & BREAKFAST - Sponsored by 
5A8:00 AM - 9:25 AMSESSION 5: HEALTH MONITORS 
5.1A8:00 AMWearable Patch for Continuous Monitoring of Sweat ElectrolytesAzar Alizadeh
Senior Material Scientist
GE Global Research
5.2A8:25 AMFlexible Oral Biosensing PlatformDavid Schwartz
Area Manager
PARC, a Xerox Company
5.3A8:45 AMGraphene-based sensor for preventative diabetic healthcareLinh Le
CEO
Bonbouton
5.4A9:05 AMLow-Power Wearable Sensors Enabled by Large-Area Flexible Organic PhotodiodesCanek Fuentes-Hernandez
Senior Research Scientist
Georgia Institute of Technology
  9:25 AMMORNING BREAK - Sponsored by  
6B8:00 AM - 9:25 AMSESSION 6: RF & SECURITY
6.1B8:00 AMOperationalizing Printed Electronics & Additive Manufacturing to Enhance Warfighter Capabilities and Strengthen the Organic Industrial BaseJames Zunino
ARDEC AM Principal/Materials Engineer
US Army RDECOM-ARDEC
6.2B8:25 AMSurface Agnostic Conformable Antenna ArraysJohn Rogers
Electrophysics Engineer
Boeing Research & Technology
6.3B8:45 AMCopper Micro-Wires for RF ApplicationsCarolyn Ellinger
Senior Research Scientist
Eastman Kodak Company
6.4B9:05 AMMultiple-In Multiple-Out (MIMO) radar and printed energy-autonomous mm-wave backscatter retrodirective wireless nodes: The birth of the Internet of Skins (IoS)Jimmy Hester
PhD Candidate
Georgia Institute of Technology
  9:25 AMMORNING BREAK - Sponsored by  
7A10:25 AM - 11:50 AMSESSION 7: HEALTH MONITORING SYSTEMS
7.1A10:25 AMFlexible Hybrid Systems for the IOTJanos Veres
Program Manager
PARC, a Xerox Company
7.2A10:50 AMDevelopment of Flexible Biometric Sensor Band with Lifesave App and Test ProtocolsPradeep Lall
MacFarlane Endowed Professor & Director
Auburn University
7.3A11:10 AMWearable Sensing Gloves for Objective Medical AssessmentsMoran Amit
Post-Doctoral Fellow
University of California, San Diego
7.4A11:30 AMDesign Considerations for Biomedical Applications Using Thin-Film Tactile Force SensorsRob Podoloff
CTO
Tekscan, Inc
  11:50 AMLUNCH - Sponsored by  
8B10:25 AM - 11:50 AMSESSION 8: DIRECT WRITE & 3D PRINTING I
8.1B10:25 AMToward the Fabrication of Electronic Circuits without using Surface Mounted ComponentsYuan Gu
Scientist
Laboratory for Physical Sciences
8.2B10:50 AM3D Printing of Polymer-Bonded Magnets Using a Combination of Extrusion Direct Write and Stereolithography MethodsCallum Bailey
Research Engineer
United Technologies Research Center
8.3B11:10 AMAerosol Jet Printed Carbon-Nanotube-Network Thin-Film-Transistors on Flexible SubstratesJialuo Chen
PhD Student
Georgia Institute of Technology
8.411:30 AMElectromagnetic Shielding of Flexible DevicesKurt Christenson
Senior Scientist
Optomec
  11:50 AMLUNCH -  Sponsored by 

 

9A1:30 PM - 2:55 PMSESSION 9: FLEXIBLE ELECTRONICS APPLICATIONS I
9.1A1:30 PMComplex Flexible Hybrid Electronic LabelsDouglas Hackler
President & CEO
American Semiconductor
9.2A1:55 PMFHE System for Touch and GestureRichard Ellinger
VP of Sales & Marketing
American Semiconductor
9.3A2:15 PMEnergy Efficient Polymeric Window and DisplayJosh Finch
Project Engineer
New Visual Media Group, LLC
9.4A2:35 PMThe Flexible Electronics behind the Graftworx SmartPatchAnthony Flannery
VP of Engineering
Graftworx
  2:55 PMAFTERNOON BREAK - Sponsored by  
10B1:30 PM - 2:55 PMSESSION 10: DIRECT WRITE & 3D PRINTING II
10.1B1:30 PMChallenges and Opportunities for 3D Printed ElectronicsJan Vardaman
President
TechSearch International, Inc. 
10.2B1:55 PMInkjet printed multilayer circuit: materials and design considerationsEmmanuel Van Kerschaver
Application Engineer
Meyer Burger Technical Systems (MBTS)
10.3B2:15 PMPrinted Electronics Using Magnetohydrodynamic Droplet Jetting of Molten Aluminum and CopperDenis Cormier
Earl W. Brinkman Professor, AMPrint Center Director
Rochester Institute of Technology
10.4B2:35 PMPrinted wireless sensor demonstrationKenneth Church
CEO
nScrypt, Inc. 
  2:55 PMAFTERNOON BREAK Sponsored by  
11A3:55 PM - 5:40 PMSESSION 11: FLEXIBLE ELECTRONICS APPLICATIONS II
11.1A3:55 PMPerovskite solar cells on flexible glassMaikel van Hest
Senior Scientist
National Renewable Energy Laboratory
11.2A4:20 PMAll-solution-processed ferroelectric capacitors for flexible non-volatile memory applications: processing conditions and short circuitsYanguang Zhang
Research Officer
National Research Council Canada
11.3A4:40 PME-Textiles Fabricated via Inkjet Printing of Particle-Free Conductive InksBill Babe
Sales & Marketing Manager
Liquid X Printed Metals
11.4A5:00 PMInkjet-Printing of Optoelectronics SensorsMartin Bolduc
Senior Researcher
INO - National Optics Institute
11.5A5:20 PMPotentials of System-in-Package Technologies for Future Bosch ProductsMartin Giersbeck
Vice President Plastics Engineering
Robert Bosch GmbH
12B3:55 PM - 5:40 PMSESSION 12: FE TOOLS & METHODS 
12.1B3:55 PMModular R2R Vacuum Coating System Platform for Pilot Scale Development and ProductionMichael Simmons
President
Intellivation
12.2B4:20 PMApplication of high-rate PECVD for improved mechanical stability of Roll-to-roll manufactured flexible organic electronics.Michiel Top
Research PhD Student
Fraunhofer FEP
12.3B4:40 PMDevelopment of a fully Integrated, Compatible, Materials Stack for Flexible Printed ElectronicsRahul Raut
Director, Strategy & Technology Acquisition
Alpha Assembly Solutions
12.4B5:00 PMTemporary bonding layers for plastic-based microfabrication of flexible displaysDavid Arreaga
CEO
Ares Materials
12.5B5:20 PMProcess Design Kit for Flexible Hybrid ElectronicsTsung-Ching Jim Huang
Sr. Research Scientist
Hewlett Packard Enterprise
THURSDAY, FEBRUARY 15, 2018
  7:00 AMREGISTRATION OPENS & BREAKFAST - Sponsored by 
13A8:00 AM - 9:45 AMSESSION 13: EMERGING CAPABILITIES 
13.1




 
A




 
8:00 AM




 
A Holistic Approach to Thermal Management in Flexible / Hybrid Electronics Using Carbon Fiber Technology




 
MP Divakar
CEO

and 

Michael Mo
Co-Founder & CEO
Stack Design Automation


and

KULR Technology
 
13.2A8:25 AMGame Changers: How multifunctional substrate and fibers enable NextFlex and AFFOAJoey Mead
Professor, Department of Plastics Engineering
University of Massachusetts, Lowell
13.3A8:45 AMA Holistic Approach Towards Flexible Hybrid Integration for Large-Area Sensor Platforms by System Design and DemonstrationsJames Sturm
Professor
Princeton University
13.4A9:05 AMLow Cost, Conformable OLCDs on Plastic - A Simple, Scalable Manufacturing Process for Organic TFT-based DisplaysPaul Cain
Strategy Director
FlexEnable
13.5A9:25 AMPhotonic Annealing of Perovskite Thin FilmsThad Druffle
Theme Leader Solar Manufacturing R&D
University of Louisville
  9:45 AMMORNING BREAK - Sponsored by  
14B8:00 AM - 9:45 AMSESSION 14: STANDARDS & RELIABILITYSPONSORED BY:  
14.1B8:00 AMIPC - Printed Electronics Design Standards UpdateNeil Bolding
Technical Manager
MacDermid Performance Solutions
14.2B8:25 AMTest Protocols Development for the Flexible Substrates in Wearable ApplicationsPradeep Lall
MacFarlane Endowed Professor & Director
Auburn University
14.3B8:45 AMStretch Testing of Flexible ElectronicsJustin Chow
Graduate Student
Georgia Institute of Technology
14.4B9:05 AMStretching Testing Method for Flexible Hybrid ElectronicsNaotsugu Ando
Chief
YUASA SYSTEM
14.5B9:25 AMMoving towards High-Volume Manufacturing with StandardsDoug Suerich
Product Evangelist
The PEER Group Inc. 
  9:45 AMMORNING BREAK - Sponsored by  
15C8:00 AM - 9:45 AMSESSION 15: FLEXIBLE ELECTRONICS MANUFACTURING
15.1C8:00 AMIntegration of Emerging and Evolving Technologies to Create Novel ProductsJohn Heitzinger
Director of Strategic Partnerships
Interlink Electronics
15.2C8:25 AMMultek Industry 4.0 StrategyBrendan Nagle
R&D Engineer
Multek
15.3C8:45 AMQRC Printed Hybrid ElectronicsKevin Rose
Director of Business Development
Fourth Dimension Engineering
15.4







 
C







 
9:05 AM







 
Evaluation of 3D Molded Interconnected Device







 
Offir Duman
Project Manager & System Engineer

and 

Yitzchak (Isaac) Shpitzer
Center of Excellence Lead for Flexible Technologies & Miniaturization
Flex





Flex


 
15.5C9:25 AMEvolution, Qualification and Latest Developments of Printed Hybrid ElectronicsMike Deppe
Director of Engineering & Project Management
Molex
  9:45 AMMORNING BREAK - Sponsored by  
16A10:15 AM - 12:00 PMSESSION 16: SENSORS & POWER
16.1A10:15 AMSystem Design for Flexible All-Organic Reflectance OximeterAna Claudia Arias
Professor
University of California, Berkeley
16.2A10:40 AMCarbon Nanotubes: Sensors and Other UsesRobert Praino
COO & Co-Founder
Chasm Technologies Inc. 
16.3A11:00 AMUltra-Thin, solid-state rechargeable battery with vertically integrated solar cellBrian Berland
Chief Science Officer
ITN Energy Systems
16.4A11:20 AMUltra-light-weight, thin-film CdTe PV minimodules on flexible ceramicVictor Plotnikov
Principal Scientist
Lucintech Inc. 
16.5A11:40 AMPrinted Carbon Nanotube Sensor for Gas DetectionDominic Miranda
Business Development Manager
Brewer Science
  12:00 PM

                                                                                                                                     Presented by:
LUNCH - Sponsored by   & STUDENT POSTER AWARDS - 

17B10:15 AM - 12:00 PMSESSION 17: SUBSTRATES
17.1B10:15 AMFlexible Glass Applications & Process ScalingSean Garner
Senior Research Associate
Corning Incorporated
17.2B10:40 AMRefinement of transparent conductive films on flexible glass by in-line flash lamp annealingManuela Junghaehnel
Group Leader S2S Technologies & Coordinator Flexible Glass Activities
Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
17.3B11:00 AMPolyester Film Substrates for Flexible and Formable ElectronicsScott Gordon
New Business Development Manager
DuPont Teijin Films
17.4B11:20 AMMulti-Material Ribbon Ceramic Supply Chain to Product Application Roadmap for FHEJohn Olenick
President
ENrG Incorporated
17.5B11:40 AMPolysulfide elastomers for use in flexible and stretchable electronicsRadu Reit
CTO
Ares Materials
  12:00 PM                                                                                                                                     Presented by: 
LUNCH - Sponsored by   & STUDENT POSTER AWARDS - 
18C10:15 AM - 12:00 PMSESSION 18: FHE CHIP INTEGRATION
18.1C10:15 AMInvestigation of Ultrathin/High IO Die Attach to Flexible SubstratesMichael Santos
Advanced Technology Engineer
Jabil
18.2C10:40 AMFlexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-based InterconnectsAmir Hanna
Postdoctoral Scholar
University of California, Los Angeles
18.3C11:00 AMPhotonic Soldering to Enhance Manufacturability of Wearable TechnologyVahid Akhavan
Senior Application Engineer
NovaCentrix
18.4C11:20 AMLow Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT eraHiroshi Komatsu
Director
CONNECTEC Japan Corporation
18.5C11:40 AMJoining to Temperature Sensitive Substrates with Asymmetric HeatingPeter McClure
Process Research Engineer
Universal Instruments Corporation
  12:00 PM                                                                                                                                     Presented by:
LUNCH - Sponsored by & STUDENT POSTER AWARDS - 
19A1:40 PM - 3:25 PMSESSION 19: CONDUCTORS 
19.1A1:40 PMNovel Low Temperature Materials as Key Enablers of Flexible Hybrid ElectronicsBawa Singh
Executive VP of Technology & Corporate Development
Alpha Assembly Solutions
19.2A2:05 PMVersatile Molecular Silver Ink Platforms for Printed ElectronicsArnold Kell
Senior Research Officer
National Research Council Canada
19.3A2:25 PMPhotonic sintering of micron particle conductive pasteHarvey Tsang
Electronics Engineer
Army Research Labs
19.4A2:45 PMAnisotropic Conductive Adhesives on Flexible Hybrid ElectronicsAngel Rodriguez
Undergraduate Student Researcher
Boise State University
19.5A3:05 PMDesign, Fabrication and Testing of High Resolution Aerospace Wear SensorAlan Shen
Ph.D. Student
University of Connecticut
   ADJOURN
20B1:40 PM - 3:25 PMSESSION 20: NEXT GEN ADVANCEMENTS
20.1B1:40 PMFlexible Haptic Actuators – Like you never felt beforeSri Peruvemba
Vice President of Marketing
Novasentis
20.2 B2:00 PMPDMS films for printed electronics - Methods and AdvancementsVictoria Tran
R&D Director
Delphon
20.3 B2:25 PMA "Flexible" solution for Internet of ThingsAbhilash Iyer
Research Engineer
Saape Designs
20.4B2:45 PMAdvancements in the manufacture of roll-to-roll smart and innovative devices by addressing production scalability and technology challengesNessima Kaabeche
R&D Product Manager
Emerson & Renwick
20.5B3:05 PMWater Vapor Transmission Rate (WVTR) Measurements for Ultra-High Barrier Materials used in the Display IndustryGeorgia Gu
Sr. Global Applications Specialist
MOCON
   ADJOURN
21C1:40 PM - 3:25 PMSESSION 21: PROCESS CONTROL
21.1C1:40 PMProcess Stackup Software for Multilayer PrintingKalsi Kwan
Electrophysics Process Engineer
Boeing Research & Technology
21.2C2:05 PMOn-Line Defect Detection in Micro-GridsTimothy Potts
President
Dark Field Technologies, Inc.
21.3C2:25 PMNon-Contact Stress Metrology for Flexible ElectronicsWojtek Walecki
CTO
Frontier Semiconductor
21.4C2:45 PMDirect digital manufacturing of human temperature monitoring device using flip chip method into silicone encapsulantSami Hawasli
Electrical Engineer
Army Research Laboratory
21.5C3:05 PMThe Second Generation of Nanoscale Printing Processes and Equipment for Flexible Sensors and ElectronicsAhmed Busnaina
William Lincoln Smith Professor
Northeastern University
   ADJOURN

For the MEMS & Sensors Technical Congress agenda, please visit: http://www.semi.org/en/mstc2018agenda

Last Updated: 2/11/2018 10:34 AM PST