2017FLEX - Short Courses

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Short Courses 

Check back frequently as more information will be added as the event approaches closer. 

Monday, June 19, 2017 

9:00 AM - 12:00 PM

1. Printing, Placement and Packaging of Flexible Hybrid Electronics
Mark Poliks, Binghamton University, James J. Watkins, University of Massachusetts, Amherst

The course will review the three main approaches to FHE as well as the underlying technologies required to deliver products and processes now and in the future. These three approached include chip-on-flex, micron scale thin-film devices on flex, and sub-micron scale self-assembled/imprinted device based coatings on flex.The discussions will include fundamentals of printing, coating and patterning technologies as well as challenges associated with pick and place attachment of thinned silicon die on flex and emerging technologies that will enable direct printing of high integration density components and devices.  Instructors from Binghamton University and the University of Massachusetts at Amherst will provide a comprehensive overview of approaches, successes and trending developments in manufacturing methods for FHE. 

Topic Description

  Introduction

  • Historical Perspective and Needs

  Tools and Components - The Basics: Printing and Coating Methods

  • Gravure, Inkjet, Flexographic, Screen, Slot-Die, Meyer Rod
  • Imprint Lithography, Sputtering, Spatial ALD

  Flexible Hybrid Electronics Overview

  Electronic Packaging Overview

  Aerosol Jet Printing

  Case Study I: A Flexible Hybrid Human Performance Monitor

  Roll-to-Roll Processing

  Materials and Processes

  • Substrates: Plastic, Metal Foil, Thin Flexible Glass
  • Coatings: Metal, TCO, Dielectrics, Thin film semiconductors
  • Vacuum processes: PVD/Sputter, Plasma etch, Laser ablation
  • Photolithographic patterning

  Case Study II: Active & Passive Integration on Thin Flexible Glass

  • Interposer, TFTs and Antennas

  Case Study III: Sensors on Paper

  Emerging Technologies

  • Directed Self Assembly
  • Nanoparticle dispersions
  • Solution-based coatings: additive driven assembly
  • Transfer printing
  • Nano-imprint Patterning

  Case Study IV: Microfluidic Based Patch Sensors

  Case Study V: Continuous Nanofabrication Processes

  • Applications and requirements
  • Large area infrared sensors
  • Large area energy and light management with meta structures
  • Antimicrobial/super hydrophobic surfaces for biomedical devices

2. Challenges and Solutions for Flexible Sensor Systems Integration
Stephen Whalley, Strategic World Ventures, Frank Shemansky, MSIG I SEMI, Janos Veres, PARC, Joseph Stetter, SPEC Sensors

This course is intended for individuals and organizations interested in exploring the latest innovations in flexible and printed sensor solutions and how they can be applied to system design.  The course will provide an overview of the state of the sensor industry and focus on key points to address in system integration when it comes to flexible, hybrid and printed designs.  The course will take a holistic approach with actual designs demonstrating how they were taken from a concept on the path to production ready, the challenges faced, and how they were overcome.  The course will also foster opportunities to ask questions on specific issues related to the topics covered.

Topic Description

Presenter

  Introductions & Course Objectives

  • Introduce instructors and get audience to identify themselves if it’s a small group
  • Go over Key Objectives for the session

Frank Shemansky/Steve Whalley

  Sensor Industry Overview

  • Overview of the general MEMS & Sensor market to cover key players, applications and size.
  • Overview of the Flexible-Hybrid-Printed Market for MEMS & Sensors
  • Brief Overview of Key Challenges to address on system integration

Frank Shemansky/Steve Whalley

  Case Study: PARC System Integration

  • Product Application & Description
  • Why Flexible-Hybrid-Printed?
  • Challenges Faced
  • Solutions Explored
  • Lessons Learned
  • Summary

Janos Veres

  Break and Networking

All

  Case Study: Spec Sensors System Integration

  • Product Application & Description
  • Why Flexible-Hybrid-Printed?
  • Challenges Faced
  • Solutions Explored
  • Lessons Learned
  • Summary

Joseph Stetter

  Summary and Q&A

All

3. 3D Printing and Additive Manufacturing
Denis Cormier, Rochester Institute of Technology, Mike Idacavage, Colorado Photopolymer Solutions, Bruce E. Kahn, Rochester Institute of Technology

This course will introduce attendees to the seven primary techniques used in commercial 3D printing processes. Attendees will get an overview of how each of the 3D printing processes works, the types of materials that they can process, and practical product design tips/techniques. The course will include special topics of broad interest such as 3D printing with high performance composite materials, light-weighting of products to enhance performance, and 3D printing with embedded electronics. 

Topic Description
  Welcome and Introductions

  3D Printing Introduction

  • Types of 3D Printing Processes
  • Materials that can be 3D Printed

  Computer-Aided Design for 3D Printing

  • 3DP File Formats
  • Part Preparation

  3D Printing Technologies

  • Vat Photopolymerization
  • Material Jetting
  • Material Extrusion
  • Powder Bed Fusion
  • Directed Energy Deposition
  • Binder Jetting
  • Sheet Lamination
  Composite 3D Printing
  Structural Optimization and Component Light Weighting

  Hybrid 3D Printing

  • Direct-Write Processes
  • 3D Printing with Embedded Electronics
  Open Discussion

1:00 PM - 4:00 PM

4. Energy: Harvesting, Storage and Management for Flexible Systems in the IOT
James W. Evans, University of California, Berkeley, Brian Zahnstecher, PowerRox LLC, Michail Kiziroglou, ATEI Thessaloniki, Christine Ho, Imprint Energy Inc. 

Power is a critical resource that prevents large‐scale adoption of the many billions of IoT and wearable devices that are projected to be central to our everyday lives in the near future. This course is about the harvesting of energy from device surroundings, the efficient storage and use of that energy, as well as power management strategies that enable reliable, cost effective powering of devices for the IoT and IIoT. The course will examine the many fundamental aspects of power solutions to help one understand the importance of power efficiency, key design tradeoffs (i.e. – cost, efficiency, manufacturability, etc.). Attendees will learn how intelligent design, in both the hardware and software space, maximizes the use of every milliwatt. Methods for evaluating energy availability from motion, thermal and solar ambient sources will also be covered, including assessment against power requirements of state-of-the-art low-power wireless sensor electronics. Practical, present-day power solutions are within the scope of the course, as well as innovations that are ready to leave the laboratory for inexpensive large-scale manufacturing. An aspect of that manufacturing is printing of supercaps and rechargeable batteries that can facilitate inexpensive energy storage to optimally match the power demand profile to the available harvested energy.

Topic Description

Presenter

  Introduction

James W. Evans

  Practical Examples of Providing Power for the IOT

Brian Zahnstecher

  Some Developments on Energy Harvesting for the IOT

Michail Kiziroglou

  Break

All

  An Example of Harvesting for the IOT

James W. Evans

  Flexible Energy Storage

Christine Ho

  Modeling Energy Harvesting and Storage

 James W. Evans

  Questions and Discussion

All

5. Reliability Assessment Protocols for Flexible Hybrid Electronics - A Course Based on Experiments and Simulations
Suresh K. Sitaraman, Georgia Institute of Technology

This course will discuss various reliability assessment techniques for flexible hybrid electronics (FHE). Some of the techniques are already developed, and several are being developed as the FHE industry gradually matures. The reliability assessment techniques for FHE will be compared against the techniques in practice for "rigid" or conventional electronics. Insight will be provided into how material, device, and system behavior changes with applied thermal and mechanical loading. Correlation between accelerated testing and field use conditions will be discussed. Various failure modes will be presented and discussed. Selected practical applications will be examined from a reliability standpoint.

Topic Description
  Overview of "Rigid" Electronics and Reliability Assessment Techniques

  Flexible Electronics and Materials of Interest

  • Substrate Materials - Polymers, Paper, Metal, Glass, Textiles
  • Printed Conductors, Resistors, Inductors, Capacitors, Batteries, Sensors, Antenna Elements, etc.
  • Assembled Components and Devices
  • Coatings and Other Protections
  Potential Uses, Usage Conditions, Operational Life of Flexible Electronics

  Reliability Assessment of Flexible Electronics - Experimental

  • Thermal, Thermal/Humidity, Shock, Vibration, Bending, Stretching, Twisting, Folding, Fluid Exposure/Corrosion
  Reliability Assessment - Physics-based Models and Computer Simulations
  Comparison Against Copper Flex Products and Other Flexible Electronics
  Pathway to Test Protocols and Reliability Assessment