|Summary|||||Agenda|||||Short Courses|||||Sponsors & Exhibitors|||||Conference Pricing|||||Networking Opportunities|||||Site Venue|||||FLEXI Awards|||||CFP|
Check back frequently as more information will be added as the event approaches closer.
Monday, June 19, 2017
9:00 AM - 12:00 PM
1. Printing, Placement and Packaging of Flexible Hybrid Electronics
Mark Poliks, Binghamton University, James J. Watkins, University of Massachusetts, Amherst, Jonathan P. Rothstein, University of Massachusetts, Amherst
The course will review the three main approaches to FHE as well as the underlying technologies required to deliver products and processes now and in the future. These three approached include chip-on-flex, micron scale thin-film devices on flex, and sub-micron scale self-assembled/imprinted device based coatings on flex.The discussions will include fundamentals of printing, coating and patterning technologies as well as challenges associated with pick and place attachment of thinned silicon die on flex and emerging technologies that will enable direct printing of high integration density components and devices. Instructors from Binghamton University and the University of Massachusetts at Amherst will provide a comprehensive overview of approaches, successes and trending developments in manufacturing methods for FHE.
2. Challenges and Solutions for Flexible Sensor Systems Integration
Stephen Whalley, Frank Shemansky, MSIG I SEMI, Janos Veres, PARC, Brian Kinkade, SPEC Sensors
This course is intended for individuals and organizations interested in exploring the latest innovations in flexible and printed sensor solutions and how they can be applied to system design. The course will provide an overview of the state of the sensor industry and focus on key points to address in system integration when it comes to flexible, hybrid and printed designs. The course will take a holistic approach with actual designs demonstrating how they were taken from a concept on the path to production ready, the challenges faced, and how they were overcome. The course will also foster opportunities to ask questions on specific issues related to the topics covered.
Introductions & Course Objectives
Frank Shemansky/Steve Whalley
Sensor Industry Overview
Frank Shemansky/Steve Whalley
Case Study: PARC System Integration
Break and Networking
Case Study: Spec Sensors System Integration
Summary and Q&A
3. 3D Printing and Additive Manufacturing
Denis Cormier, Rochester Institute of Technology, Mike Idacavage, Colorado Photopolymer Solutions, Bruce E. Kahn, Rochester Institute of Technology
This course will introduce attendees to the seven primary techniques used in commercial 3D printing processes. Attendees will get an overview of how each of the 3D printing processes works, the types of materials that they can process, and practical product design tips/techniques. The course will include special topics of broad interest such as 3D printing with high performance composite materials, light-weighting of products to enhance performance, and 3D printing with embedded electronics.
|Welcome and Introductions|
3D Printing Introduction
Computer-Aided Design for 3D Printing
3D Printing Technologies
|Composite 3D Printing|
|Structural Optimization and Component Light Weighting|
Hybrid 3D Printing
1:00 PM - 4:00 PM
4. Energy: Harvesting, Storage and Management for Flexible Systems in the IOT
James W. Evans, University of California, Berkeley, Brian Zahnstecher, PowerRox LLC, Michail Kiziroglou, ATEI Thessaloniki, Christine Ho, Imprint Energy Inc.
Power is a critical resource that prevents large‐scale adoption of the many billions of IoT and wearable devices that are projected to be central to our everyday lives in the near future. This course is about the harvesting of energy from device surroundings, the efficient storage and use of that energy, as well as power management strategies that enable reliable, cost effective powering of devices for the IoT and IIoT. The course will examine the many fundamental aspects of power solutions to help one understand the importance of power efficiency, key design tradeoffs (i.e. – cost, efficiency, manufacturability, etc.). Attendees will learn how intelligent design, in both the hardware and software space, maximizes the use of every milliwatt. Methods for evaluating energy availability from motion, thermal and solar ambient sources will also be covered, including assessment against power requirements of state-of-the-art low-power wireless sensor electronics. Practical, present-day power solutions are within the scope of the course, as well as innovations that are ready to leave the laboratory for inexpensive large-scale manufacturing. An aspect of that manufacturing is printing of supercaps and rechargeable batteries that can facilitate inexpensive energy storage to optimally match the power demand profile to the available harvested energy.
5. Reliability Assessment Protocols for Flexible Hybrid Electronics - A Course Based on Experiments and Simulations
Suresh K. Sitaraman, Georgia Institute of Technology
This course will discuss various reliability assessment techniques for flexible hybrid electronics (FHE). Some of the techniques are already developed, and several are being developed as the FHE industry gradually matures. The reliability assessment techniques for FHE will be compared against the techniques in practice for "rigid" or conventional electronics. Insight will be provided into how material, device, and system behavior changes with applied thermal and mechanical loading. Correlation between accelerated testing and field use conditions will be discussed. Various failure modes will be presented and discussed. Selected practical applications will be examined from a reliability standpoint.
|Overview of "Rigid" Electronics and Reliability Assessment Techniques|
Flexible Electronics and Materials of Interest
|Potential Uses, Usage Conditions, Operational Life of Flexible Electronics|
Reliability Assessment of Flexible Electronics - Experimental
|Reliability Assessment - Physics-based Models and Computer Simulations|
|Comparison Against Copper Flex Products and Other Flexible Electronics|
|Pathway to Test Protocols and Reliability Assessment|