SEMI Members Only 2017Flex Presentation Download

SEMI Members Only 2017Flex Presentation Download

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2017Flex was held in Monterey, California, USA from June 19-22, 2017.

Access the agenda by day: TUESDAY, 6/20/17  |  WEDNESDAY, 6/21/17  |  THURSDAY, 6/22/17 

TUESDAY, JUNE 20, 2017
1A8:00 AM - 10:00 AMPLENARY 1:  MARKET & ROAD MAPS
 Click here to download presentations for SEMI Members Only from PLENARY 1:  MARKET & ROAD MAPS
1.1A8:00 AM2017FLEX IntroductionKeith RollinsDuPont Teijin Films
1.2 A8:05 AM

Welcoming Remarks

Ajit ManochaSEMI
1.3A8:10 AMTechnology Inflections in the Display IndustryBrian ShiehApplied Materials
1.4A8:45 AMFlexible and Stretchable Hybrid Electronics Manufacturing for Wearables: Challenges and SolutionsAnwar Mohammed
Jason Marsh
Flex
NextFlex
1.5A9:25 AMOptimizing the Design Process for Flexible HybridsDavid WiensMentor, a Siemens Business
1.6A9:50 AMSponsored by:
FLEXI Awards Ceremony
Daren HeidgerkenLockheed Martin
  10:00 AMMORNING BREAK SPONSORED BY: 
2A10:50 AM - 12:40 PMPLENARY 2:  MARKET & ROAD MAPS
 Click here to download available presentations for SEMI Members Only from PLENARY 2:  MARKET & ROAD MAPS 
2.1A10:50 AMeHealth new horizons with the Internet of ThingsDavid BordonadaLibelium
2.2A11:25 AMTen Challenges for the Flex/Hybrid Industry in the Ag-Food VerticalFrancis GouillartExperience Co-Creation Partnership (ECCP)
2.3A11:50 AMTechnology Roadmap: Trends and Needs in Printed and Flexible ElectronicsStan Farnsworth OE-A; NovaCentrix
2.4A12:15 PMWhen Flexible Electronics Reach Critical MassDean FreemanGartner
  12:40 PMLUNCHSPONSORED BY: 
3A2:15 PM - 4:00 PMSESSION 3: FLEXIBLE DISPLAYS
 Click here to download available presentations for SEMI Members Only from SESSION 3: FLEXIBLE DISPLAYS
3.1 A2:15 PMFlexible Electrophoretic Displays Go Big!Michael McCrearyE Ink
3.2A2:35 PMOLED on Flexible Organic TFTs: Could Organic Semiconductors Revive Old Fabs and Enable Wrinkable AMOLED Displays and New Applications?Eric VireyYole Développement
3.3A3:00 PMFlexible Organic Electronics: From Lab to Fab to the Next Wave of ProductsMike BanachFlexEnable
3.4A3:20 PMPI-SCALE: Creating an Open Access Flexible OLED Pilot Line ServicePavel KudlacekHolst Centre
3.5A3:40 PMFlexTrans - A Project to Transfer Flexible OLED Display Manufacture to IndustryMichael CowinSmartKem Ltd
  4:00 PMEXHIBITOR RECEPTION
4B2:15 PM - 4:00 PMSESSION 4: FPE TECHNOLOGIES
 Click here to download available presentations for SEMI Members Only from SESSION 4: FPE TECHNOLOGIES
4.1B2:15 PMRoll-to-Roll Processing Inflections for the Display & IoT IndustryMani ThothadriApplied Materials
4.2B2:40 PMMaterials for Printed Transistors: More than Proof of Concept!Paul BrookesEMD Performance Materials Corp
4.3B3:00 PMA highly-efficacious Self-compensation Means to Reduce Variations due to the Bending of the SubstrateJoseph ChangNanyang Technological University Singapore
4.4B3:20 PMNew UV Nanoimprint Lithography Roll2Roll Technologies - from Lab2FabThomas KolbuschCoatema Coating Machinery GmbH
4.5B3:40 PMFlexible Polyimide as a Device Substrate Temporarily Bonded to Round Silicon Carriers Allowing Processing in Standard Rigid Semiconductor Equipment Emmett HowardFlexible Electronics and Display Center of Arizona State University
  4:00 PMEXHIBITOR RECEPTION
5C2:15 PM - 4:00 PMSESSION 5: FHE MANUFACTURING METHODS I
 Click here to download available presentations for SEMI Members Only from SESSION 5: FHE MANUFACTURING METHODS I
5.1C2:15 PMNextFlex Roadmap for a Flexible Hybrid Electronics Manufacturing EcosystemBenjamin LeeverAir Force Research Laboratory
5.2C2:40 PMAdditive Manufacturing Equipment for Flexible Hybrid ElectronicsPeter HessneySensor Films Inc.
5.3C3:00 PMBridging the Interconnect Gap in Flexible Hybrid ElectronicsVal MarinovUniqarta, Inc.
5.4C3:20 PMFlexTrateTM CharacterizationTak FukushimaUniversity of California, Los Angeles
5.5C3:40 PMNew Silicon Frontiers: Physically Flexible System-on-ChipDouglas HacklerAmerican Semiconductor, Inc.
  4:00 PMEXHIBITOR RECEPTION
WEDNESDAY, JUNE 21, 2017
6A8:00 AM - 9:25 AMSESSION 6: STANDARDS & RELIABILITYSPONSORED BY: 
 Click here to download available presentations for SEMI Members Only from SESSION 6: STANDARDS & RELIABILITY
6.1A8:00 AMRecent developments in IPC Printed Electronics StandardsNeil BoldingMacDermid Enthone Industrial Solutions
6.2A8:25 AMOverview of IEC Activities Related to FHE, including IEC TC 110 and TC 119Kei HyodoKonica Minolta
6.3A8:45 AMAdvances in Flexible Hybrid Electronics ReliabilityDouglas HacklerAmerican Semiconductor, Inc.
6.4A9:05 AMAccurate Testing of Flexible Hybrid Electronics Using Tension-Free SystemsNaotsugu AndoYUASA SYSTEM
  9:25 AMMORNING BREAKSPONSORED BY: 
7B8:00 AM - 9:25 AMSESSION 7: FPE MANUFACTURING FACILITIES
 Click here to download available presentations for SEMI Members Only from SESSION 7: FPE MANUFACTURING FACILITIES
7.1B8:00 AMPrinted Electronics at CDTMiguel Carrasco-OrozcoCambridge Display Technology Ltd
7.2B8:25 AMGrowth of New Printed Intelligence Driven Industry and ProductsHarri KopolaVTT Technical Research Centre of Finland Ltd
7.3B8:45 AMTools and Technology for Flexible Hybrid ElectronicsMarcel GrootenDoMicro BV
7.4B9:05 AMPrototyping of Printed TFTs on Pilot Line for Smart Surface ApplicationMicael CharbonneauCEA-LITEN
  9:25 AMMORNING BREAKSPONSORED BY: 
8C8:00 AM - 9:25 AMSESSION 8: FHE MANUFACTURING METHODS II
 Click here to download available presentations for SEMI Members Only from SESSION 8: FHE MANUFACTURING METHODS II
8.1C8:00 AMGlobal OLED Market with Key Technologies: Solution Process OLEDChoong Hoon YiUBI Research 
8.2C8:25 AMPrinted Hybrid Sensors for Health MonitoringRobert StreetPARC, a Xerox Company
8.3C8:45 AMFlexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilmTM TechnologyScott GoodwinMicross Advanced Interconnect Technology
8.4C9:05 AMAdvancements in the Manufacture of Sensor Systems for Biomarker MonitoringRob IrwinMolex, LLC
  9:25 AMMORNING BREAKSPONSORED BY: 
9A10:25 AM - 11:50 AMSESSION 9: CONDUCTORS I
 Click here to download available presentations for SEMI Members Only from SESSION 9: CONDUCTORS I
9.1A10:25 AMPossibilities and Limitations of Stretchable Electronics on TPUMilan SaalminkTNO/Holst Centre
9.2A10:50 AMAdvanced Sheet-to-Sheet and Roll-to-Roll Thin-film Processing on Ultra-thin Flexible Glass for Flexible Electronic DevicesManuela JunghähnelFraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
9.3A11:10 AMBiodegradable conductors on biodegradable polymer foilsMichael HoffmannFraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
9.4A11:30 AMControllable Fabrication of Transparent Touch Sensitive Device via Inkjet-Printing Polydopamine Nanoparticles on Flexible Substrate with Tunable Wetting PropertiesLiang LiuBinghamton University
  11:50 AMLUNCH

SPONSORED BY: 

   

10B10:25 AM - 11:50 AMSESSION 10: FPE APPLICATIONS
 Click here to download available presentations for SEMI Members Only from SESSION 10: FPE APPLICATIONS
10.1B10:25 AMPrinted Electronics: Success Stories and Future Commercial ApplicationsGuillaume ChansinIDTechEx
10.2B10:50 AMAll-Printing Process for Stretchable LED Matrix DisplayShu-Hao ChangAU Optronics
10.3B11:10 AMeWriters and the Leap to Commercialization in Flexible Electronic ComponentsErica MontbachKent Displays
10.411:30 AMIntegration and Scalable Manufacturing of Printed Microfluidic DevicesJeffrey MorseUniversity of Massachusetts, Amherst
  11:50 AMLUNCH

SPONSORED BY: 

   

11C10:25 AM - 11:50 AMSESSION 11:  FHE APPLICATIONS I
 Click here to download available presentations for SEMI Members Only from SESSION 11:  FHE APPLICATIONS I
11.1C10:25 AMHydration Sensor Patch for Human Performance MonitoringAzar Alizadeh GE
11.2C10:50 AMScalable Sensor Fusion Platform for Multi-Modal Human-Machine Interface ApplicationsAlbert LuInterlink Electronics Inc.
11.3C11:10 AMRFID Technology Transitional Tipping PointRaymond C. WileySun-Tec America, LLC
11.4C11:30 AMPhysically Flexible Smart Asset Monitor and Tracking TagRichard EllingerAmerican Semiconductor, Inc.
  11:50 AMLUNCH

SPONSORED BY: 

   

12A1:30 PM - 2:55 PMSESSION 12: CONDUCTORS II
 Click here to download available presentations for SEMI Members Only from SESSION 12: CONDUCTORS II
12.1A1:30 PMAdvancements in Printing nano Copper and Using Existing Copper Based Manufacturing ProcessesMichael CarmodyIntrinsiq Materials
12.2A1:55 PMAdvanced Conductive Films by Dielectrophoretic Alignment of ParticlesHenrik HemmenCondAlign
12.3A2:15 PMDirect Metallization PolyimideScott TrevinoPalPilot International
12.4A2:35 PMAdvanced Inkjet Capabilities: Challenging Screenprint PerformanceVahid AkhavanNovaCentrix
  2:55 PMAFTERNOON BREAKSPONSORED BY: 
13B1:30 PM - 2:55 PMSESSION 13: SUBSTRATES
 Click here to download available presentations for SEMI Members Only from SESSION 13: SUBSTRATES
13.1B1:30 PMFlexible Sintered Roll Format Ceramic for Electronic ApplicationsJohn OlenickENrG Incorporated
13.2B1:55 PMResearch and Testing of Electronic Materials Made with a Novel Non-Silicone Stretchable Thermosetting PolymerTomoaki SawadaPanasonic Automotive and Industrial Systems
13.3B2:15 PMNovel Polysulfide Substrates for Manufacturing Flex Displays and Flex ElectronicsTolis VoutsasAres Materials
13.4B2:35 PMPlastic Film for Flat and Curved Display SurfacesShintaro OzakiRikentechnos
  2:55 PMAFTERNOON BREAKSPONSORED BY: 
14C1:30 PM - 2:55 PMSESSION 14: FHE APPLICATIONS II
 Click here to download available presentations for SEMI Members Only from SESSION 14: FHE APPLICATIONS II
14.1C1:30 PMFlexible Near Field Communication Sensor Labels Built on a Printed Dopant Polysilicon TFT PlatformSoumya KrishnamoorthyThin Film Electronics
14.2C1:55 PMThermistor Arrays for Asset MonitoringAustin ShearinBrewer Science
14.3C2:15 PMIoT with Flexible ElectronicsAbhilash IyerSaape Designs
14.4 C2:35 PME-textiles: Show Me the Money!James HaywardIDTechEx
  2:55 PMAFTERNOON BREAKSPONSORED BY: 
15A3:55 PM - 5:40 PMSESSION 15: INLINE INSPECTION
 Click here to download available presentations for SEMI Members Only from SESSION 15: INLINE INSPECTION
15.1A3:55 PMIn Situ Materials CharacterizationBryan BarneyNVision Instruments Inc
15.2A4:20 PMIn-Situ Defect Detection: Practical Considerations and ResultsTim PottsDark Field Technologies, Inc.
15.3A4:40 PMHigh-speed, high resolution 3D metrology for improved process control of flexible electronic substrate productionErik Novak4D Technology
15.4A5:00 PMIntroduction to new high-resolution 3D Line Confocal Imaging technology and its potential uses in automated three-dimensional conductor trace profile, surface roughness and ink thickness measurement applications.Juha SailyFocalSpec, Inc.
15.5A5:20 PMMetrology Tools for Flexible Electronics and Display SubstrateMin YangBruker Nano Surfaces
16B3:55 PM - 5:40 PMSESSION 16: ENCAPSULATION & COATINGSPONSORED BY:  
 Click here to download available presentations for SEMI Members Only from SESSION 16: ENCAPSULATION & COATING
16.1B3:55 PMFrom flexible towards foldable thin film encapsulation for air stable OLED devicesPavel KudlacekHolst Centre
16.2B4:20 PMBringing Permeation Barrier Technology to Application: From Ultra-High Barrier Films to Functional Films for Flexible ElectronicsJohn FahlteichFranhofer
16.3B4:40 PMAdvanced Co-Polymers as Innovative Substrates and Encapsulants for Flexible Hybrid ElectronicsChris StoesselEastman Chemical Co.
16.4B5:00 PMFlexible Functional Devices at Mass Production Level with the FLEx R2R sALD PlatformEdward ClerkxMeyer Burger (Netherlands) B.V.
16.5B5:20 PMAn Overview of Energy Curable TechnologiesChris OrilallSartomer Americas
17C3:55 PM - 5:40 PMSESSION 17: POWER TECHNOLOGY
 Click here to download available presentations for SEMI Members Only from SESSION 17: POWER TECHNOLOGY
17.1C3:55 PMAll Solid State, Thin Film Lithium Rechargeable Battery for Flexible ElectronicsBrian BerlandITN Energy Systems, Inc.
17.2C4:20 PMFlexible Thermoelectric Energy Harvesters with Liquid Metal InterconnectsMehmet OzturkNC State University & ASSIST Engineering Research Center
17.3C4:40 PMFlexible and Stretchable Power Sources for Wearable ApplicationsAlla ZamarayevaUniversity of California Berkeley
17.4C5:00 PMHighly Reduced Graphene Oxide for Supercapacitor by Combining UV Irradiation and Thermal TreatmentIn Gyoo KimETRI
17.5C5:20 PMDevelop of a Very Thin "Flexible" Battery and Process for ManufacturingJim ManningCustom Electronics
THURSDAY, JUNE 22, 2017
18A8:00 AM - 9:45 AMSESSION 18:  PRINTING TECHNOLOGYSPONSORED BY:  
 Click here to download available presentations for SEMI Members Only from SESSION 18:  PRINTING TECHNOLOGY
18.1A8:00 AMAdvanced Flexible Substrate Technology for Improved Accuracy, Definition, and Conductivity of Screen Printed ConductorsArt DobieChromaline
18.2A8:25 AMReverse-offset Printing Process and Equipment for Fine Patterning and Precision OverlayDongwoo KangKorea Institute of Machinery & Materials
18.3A8:45 AMFlexible and Printable Li-ion BatteriesRyan KohlmeyerAir Force Research Laboratory
18.4A9:05 AMResearch on Manufacturing of Plastic Films and Filaments through Roll to Roll ProcessingReza MahboubfarFH Aachen University of Applied Sciences
18.5A9:25 AMInnovative Roll-to-Roll Equipment and Material Development Suite for Next Generation Technology from Carpe Diem Technologies and the University of Massachusetts AmherstJohn BergCarpe Diem Technologies, Inc.
  9:45 AMMORNING BREAKSPONSORED BY: 
19B8:00 AM - 9:45 AMSESSION 19: 3D PRINTING
 Click here to download available presentations for SEMI Members Only from SESSION 19: 3D PRINTING
19.1B8:00 AMClosed-Loop Template-free printing of Passive ComponentsDan BerriganAir Force Research Laboratory
19.2B8:25 AM3D Printing of Flexible Circuits and SensorsMatthew SchrandtOptomec
19.3B8:45 AMHybrid Printed Fabrication of Munitions Components & SystemsJames ZuninoUS Army ARDEC
19.4B9:05 AMAerosol-Based Process and Apparatus for Stable Production-Level Printing of Electronic InksDave KeicherSandia National Laboratories
19.5B9:25 AM3D and Aerosol-printed Conductor-dielectric Full-3D RF MetamaterialsJesse TiceNorthrop Grumman
  9:45 AMMORNING BREAKSPONSORED BY: 
20C8:00 AM - 9:45 AMSESSION 20: SENSORS
 Click here to download available presentations for SEMI Members Only from SESSION 20: SENSORS
20.1C8:00 AMDesign and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM)Charles Woychiki3 Electronics, Inc.
20.2C8:25 AMScalable Self-aligned Active Matrix IGZO TFT Backplane Technology and its Use in Flexible Semi-transparent Image SensorsAlbert van BreemenHolst Centre
20.3C8:45 AMShort Wavelength Infrared Photosensors Based on Novel Narrow Bandgap PolymersTse Nga NgUniversity of California San Diego
20.4C9:05 AMPrinted and Flexible MRI Receive CoilsAna Claudia AriasUniversity of California Berkeley
20.5C9:25 AMFlexible “Roll-up” Voice-Separation and Gesture-Sensing Human-Machine Interface with All-Flexible SensorsJames SturmPrinceton University
  9:45 AMMORNING BREAKSPONSORED BY: 
21A10:15 AM - 12:00 PMSESSION 21: NOVEL CONDUCTOR AND SEMICONDUCTOR MATERIALS
 Click here to download available presentations for SEMI Members Only from SESSION 21: NOVEL CONDUCTOR AND SEMICONDUCTOR MATERIALS
21.1A10:15 AMAgeNT™: AgNW/Carbon Nanotube Hybrid TCF – Progress UpdateBob PrainoChasm Technologies, Inc.
21.2A10:40 AMGraphene as Flexible Transparent ConductorTom FedolakGraphenea Inc.
21.3A11:00 AMLiquid Silicon Ink for Printable Active ComponentsDoug FreitagThe Coretec Group
21.4A11:20 AMNanocarbon Contacts in Flexible Electronics ApplicationsJeongwon ParkUniversity of Ottawa
21.5A11:40 AMSynthesis, Characterization, and Isolation of Metal Precursor InksBruce KahnRochester Institute of Technology
  12:00 PM

                                                                          Presented by:
LUNCH & STUDENT POSTER AWARDS -  

SPONSORED BY: 
22B10:15 AM - 12:00 PMSESSION 22: DIRECT WRITE
 Click here to download available presentations for SEMI Members Only from SESSION 22: DIRECT WRITE
22.1B10:15 AMDirect-write fabrication of high-density interconnectsAlan ShenUnited Technologies Research Center
22.2B10:40 AM3D Flexible Metal Interconnection for FHE (flexible hybrid electronic) Devices using an Electrohydrodynamic (EHD) TechniqueYongjin KimKorea Institute of Machinery and Materials (KIMM)
22.3B11:00 AMBreakthrough dielectric and conductive material combinations for inkjet-printed multi-layer circuitsWouter BrokMeyer Burger
22.4B11:20 AMDirect-write printed electronics on textiles: A paradigm for automated textile electronicsRaj BhaktaNorth Carolina State University, ASSIST Research Center
22.5B11:40 AMUltra-Narrow Channels and Lines for All-Printed OTFTsTa-Ya ChuNational Research Council Canada
  12:00 PM                                                                          Presented by:
LUNCH & STUDENT POSTER AWARDS -  
SPONSORED BY: 
23C10:15 AM - 12:00 PMSESSION 23: RF TECHNOLOGY
 Click here to download available presentations for SEMI Members Only from SESSION 23: RF TECHNOLOGY
23.1C10:15 AMAdvancements in wireless technology for flexible printed hybrid electronics: how Near Field Communication (NFC) is shaping the architecture of sensor systemsJesse ColeMolex, LLC.
23.2C10:40 AMAerosol Jet Printed Functional Nanoinks: From New Materials to RF ComponentsJesse TiceNG Next, Northrop Grumman
23.3C11:00 AMNext generation of origami-based tunable RF structures using additive manufacturingSyed Abdullah NaurozeGeorgia Institute of Technology
23.4C11:20 AMDirect-Write Flexible Meshed Patch Antenna on Nonwoven MaterialHasan ShahariarNorth Carolina State University
23.5C11:40 AMRF Powered Transformable Sensor on a Flexible SubstrateYunsong XieArgonne National Laboratory
  12:00 PM                                                                          Presented by:
LUNCH & STUDENT POSTER AWARDS -  
SPONSORED BY: 
24A1:40 PM - 3:25 PMSESSION 24: MILITARY & SECURITYSPONSORED BY:  
 Click here to download available presentations for SEMI Members Only from SESSION 24: MILITARY & SECURITY
24.1A1:40 PMUtilizing Carbon Nanotubes in Thin-Film Flexible ElectronicsJon NicholsLockheed Martin
24.2A2:05 PMAll-Printable Real-time Airframe Monitoring System (ARAMS)Shiv JoshiNextGen Aeronautics, Inc
24.3A2:25 PMManufacturing Technologies to Enable Advanced MunitionsGiuseppe Di BenedettoUS Army ARDEC
24.4A2:45 PMManufacturing for Tunable, Flexible Polymer Substrates for Asset MonitoringClaire LepontUniversity of Massachusetts, Lowell
24.5A3:05 PMMaterials & Manufacturing Challenges for Wearable Electronics in the USAF MissionJeremy WardAir Force Research Laboratory
   ADJOURN
25B1:40 PM - 3:25 PMSESSION 25: EMERGING CAPABILITIES
 Click here to download available presentations for SEMI Members Only from SESSION 25: EMERGING CAPABILITIES
25.1B1:40 PMPrinting of Nano and Microscale Electronics and SensorsAhmed BusnainaNano OPS, Inc.
25.2B2:00 PMHighly Near-Infrared-Sensitive, Printed Flexible Thermistors Austin ShearinBrewer Science
25.3B2:25 PMDevelopment of Scalable Manufacturing of Printed Electronics in an Open Access TestbedDevin MacKenzieUniversity of Washington
25.4B2:45 PMSilver-based Ultrathin Transparent Top Electrode for Organic Light Emitting DiodesKwan Hyun ChoKorea Institute of Industrial Technology (KITECH)
25.5B3:05 PMHybrid Additive Process for Slot Coating of Alternating-Stripe FilmsAra ParsekianGeorgia Institute of Technology
   ADJOURN
26C1:40 PM - 3:25 PMSESSION 26: BIOSENSORS & THE ENVIRONMENT AROUND US
 Click here to download available presentations for SEMI Members Only from SESSION 26: BIOSENSORS & THE ENVIRONMENT AROUND US
26.1C1:40 PMA Flexible Hybrid Electronics (FHE) Wearable Biometric Human Performance Monitor (BHPM)Jim TurnerBinghamton University
26.3C2:10 PMFusion of Fashion and Function: Textiles as a Platform for a Flexible Electronics SystemSundaresan JayaramanGeorgia Institute of Technology
26.4C2:35 PMPeratech Force Sensing Technology SolutionsWilliam BeckenbaughPeratech
26.5C3:00 PMTitania-based sol-gels with Tunable Dielectric and Optical PropertiesRobert NorwoodUniversity of Arizona
   ADJOURN