2017 FLEX

June 19 - 22, 2017
8 AM - 5 PM

Technical Program
Portola Hotel & Spa
2 Portola Plaza
Monterey, California

Exhibits
Monterey Conference Center

Contact
FlexTech –
a SEMI Strategic Association Partner
+1 (408) 943-7906
2017FLEX@flextech.org

Flexible Electronics – Accelerating to Manufacturing

Summary

Having completed its 15th year, FLEX will return in 2017 to Monterey, June 19-22, 2017, on the beautiful Monterey Peninsula on California’s Pacific coastline. Monterey brings the fun and intimacy of a resort-setting to the professional and technology development focus of the event. Business and pleasure mix well in this beautiful location.

The Flex Conference is the best flexible hybrid electronics FHE event in the industry – guaranteed to advance your technical and business interests in flexible, printed, hybrid electronics and their applications. We hope you join us next year!

Week in Review

FLEX at a Glance

View Slideshow

Executive Committee

Conference Chairs

  • Thomas Kolbusch, Coatema Coating Machinery GmbH
  • Neil Morrison, Applied Materials
  • Bob Praino, Chasm Technologies
  • Laura Rea, Air Force Research Lab

Conference Advisors

  • Reinhard Baumann, TU Chemnitz, Germany
  • Debasis Bera, Samsung Information Systems of America
  • Karlheinz Bock, Technische Universität Dresden, Germany
  • Ahmed Busnaina, Northeastern University
  • Paul Cain, FlexEnable, UK
  • Steven Farias, NanoDirect LLC
  • Scott Ferguson, CLEARink Displays
  • Sean Garner, Corning
  • Emmett Howard, Arizona State University
  • Sonoko Ishimaru, Toyobo Co., Ltd.
  • Kei Hyodo, Konica Minolta, Inc.
  • Mike Idacavage, Colorado Photopolymer Solutions
  • Brian H. Johnston, Sensor Films Incorporated
  • Bruce E. Kahn, Rochester Institute of Technology
  • Toshihide Kamata, AIST/JAPEC
  • Asad Khan, Kent Displays
  • Ken Koldan, FlexCon
  • Hilary Lackritz, SRI International
  • Tim Luong, Ceradrop MGI Group
  • Jason Marsh, NextFlex
  • Toshiya Miyaji, SCREEN Holdings
  • Eric Novak, 4D Technology
  • Luu Nguyen, Texas Instruments Inc.
  • Alexandra Pekarovicova, Western Michigan University
  • Mark Poliks, Binghamton University
  • Robert Reuss, Chemistry & Electronics Technology
  • Chizu Sekine, Sumitomo Chemical Co., Ltd
  • Bob Sprague, Amazon | Lab 126
  • Andrew Steckl, University of Cincinnati
  • Stephen Whalley, MEMS Industry Group
  • Wayne VanZandt, MicroConnex
  • Tolis Voutsas, Sharp Labs of America
  • Yu Xia, Polyera
  • In-Kyu You, ETRI