2016FLEX to Gather over 600 Experts in Flexible Hybrid Electronics

SAN JOSE, Calif. ─ February 11, 2016 – Over 600 electronics professionals are expected to attend the 15th annual Flexible and Printed Electronics Conference and Exhibition (2016FLEX) at the Monterey Marriott February 29-March 3.  The event is organized by FlexTech, a SEMI Strategic Association Partner.  2016FLEX features market and technical presentations, short courses, poster sessions, exhibits and networking, focused on flexible, printed, hybrid devices, including new materials, processes, equipment, devices and products. 

The Technical Conference will highlight over 120 presentations selected from U.S. and international submittals. Application experts will cover health monitors, asset monitors, advanced sensors, displays, advanced lighting, energy harvesting, and communications products, from organizations, including AU Optronics, Eastman Kodak, Flex International, GE, IBM Research, Interlink Electronics, PARC, SRI, Stanford, U.S. Department of Defense (DoD), and many more.

Manufacturing and materials experts will cover popular topics include integration of ICs on flexible, stretchable substrates, barrier coatings for components, OLED developments, biometric collection and analysis, power generation, roll-to-roll coating, testing and reliability measurement devices and new materials for interconnections.  2016FLEX includes presentations from American Semiconductor, Applied Materials, DuPont, ENrG, Sun-Tec, SmartKem, and many more.

The conference begins Monday, February 29 with five, three-hour Short Courses: 

  • Introducing Printed Electronics – All the Basics and More!
  • Technology-Readiness Level (TRL) and Manufacturing Readiness Levels  (MRL) Assessment: Assessing DoD’s products and processes; also insight about how to move from level to level
  • Flexible Hybrid Electronics
  • Fusion of Fashion and Function: Textiles as a Platform
  • 3D Printing on Plastics – Developments & Trends  

FlexTech will present the 2016 FLEXI awards to leaders in the flexible hybrid electronics community at the Industry Dinner on Wednesday, March 2.  Awards are given to the Most Innovative Product, Most Significant R&D Activity, Leadership in Education, and Industry Leadership, a new category this year for individuals who have contributed their talents and time in growing the sector.  Student poster awards will also be presented. 

2016FLEX is also the first event that NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, is participating in.  NextFlex will give an update during the Roadmap Session and have official meetings with its technology working groups.  

For more information or to arrange for interviews before or during the event, please contact Heidi Hoffman, FlexTech at 408.943.7954, or at heidi.hoffman@flextech.org.  To register, visit 2016FLEX.com.

About FlexTech
FlexTech, a SEMI Strategic Association Partner, is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics, by developing solutions for advancing these technologies from R&D to commercialization. Visit FlexTech at www.flextech.org.

About SEMI

SEMI connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance electronics manufacturing. Members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  Visit SEMI at www.semi.org; follow SEMI on LinkedIn and Twitter.

Association Contact
Heidi Hoffman/FlexTech
Email: heidi.hoffman@flextech.org
Phone: 408.943.7954

 

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