Events
Highlights
- March 2014 issue of SEMI Global Update Now Available
- Fab Equipment Spending to Increase 20-30 Percent in 2014
- New SEMICON Europa in Grenoble to Emphasize Innovation and Applications
- Call for Papers Open for SEMICON Europa 2014 and Plastic Electronics 2014
- North American Semiconductor Equipment Industry Posts January 2014 Book-to-Bill Ratio of 1.04
- Silicon Wafer Revenues Decline in 2013
- February 2014 Issue of SEMI Global Update Now Available
- 2014 Capital Spending Up in Korea; SEMICON Korea 2014 to Address Mobile Innovation
- New Edition of the International Technology Roadmap for PV (ITRPV) — at Upcoming PV Fab Managers Forum in China
- Europe Leaders to Examine EC’s Ambitious Goal — 20% Market Share of Global Semiconductor Manufacturing by 2020
- North American Semiconductor Equipment Industry Posts December 2013 Book-to-Bill Ratio of 1.02
- Xilinx and University of Florida Honored with SEMI Award for Advancements in Interposers and CMOS Fab Process
- Economic Recovery and Pervasive Computing to Propel Semiconductor Manufacturing Supply Chain
- Semiconductor Plastic Packaging Materials Market to Approach $21 Billion by 2017
- Crisis? What Crisis? New Paradigm Adjustments for Capacity and Equipment Spending
- January 2014 Issue of SEMI Global Update Now Available
- SEMI Reports Shift in Semiconductor Capacity and Equipment Spending Trends
- North American Semiconductor Equipment Industry Posts November 2013 Book-to-Bill Ratio of 1.11
- SEMI Testifies in Support of U.S. Manufacturing Legislation before House Science Committee’s Subcommittee on Research and Technology
- SEMICON West Call for Papers for New Semiconductor Technology Symposium, Science Park and TechXPOTs
- SEMI Reports Third Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings $7.65 Billion
- December 2013 Issue of SEMI Global Update Now Available
- 2013 Semiconductor Equipment Sales Forecast $32 Billion; Strong Growth Forecast for 2014
- New Taiwan Exhibition Co-Location Bridges LED Manufacturing and Lighting Supply Chains
- North American Semiconductor Equipment Industry Posts October 2013 Book-to-Bill Ratio of 1.05
- SEMI Board Member Testifies to U.S. Senate; Advocates for Advanced Manufacturing
- Sold Out SEMI Malaysia Forum Tackles Assembly & Test Issues in Southeast Asia
- Slight Decline in Third Quarter 2013 Silicon Wafer Shipments
- Semiconductor Manufacturing: ASMC 2014 Offers Visibility and Opportunity for Presenters Deadline November 28
- Applied Materials Chairman Mike Splinter Awarded Semiconductor Industry's Highest Honor
- November Issue of SEMI Global Update Now Available
- Focus on the Power of Innovation with Keynotes from AIST, GlobalFoundries, and Soitec at SEMICON Japan 2013
- Plastic Electronics Conference to Rotate Between Dresden and Grenoble Beginning in 2014
- SEMI Endorses Bipartisan U.S. Manufacturing Bill
- North American Semiconductor Equipment Industry Posts September 2013 Book-to-Bill Ratio of 0.97
- Benedetto Vigna of STMicroelectronics Honored with European SEMI Award 2013
- Countdown for SEMICON Europa and Plastic Electronics 2013
- October Issue of SEMI Global Update Now Available
- SEMI Announces Silicon Wafer Shipment Forecast
- From Smart Cars to Smart Cities: Shaping the Future of Microelectronics at ITPC 2013
- Total Cost of Ownership Guide for PV Manufacturing Closes Communication Barrier
- Spotlight on New Material Requirements and Outlook for Memory, Logic, MEMS, Beyond-CMOS Devices, and More - at the SEMI Strategic Materials Conference 2013
- North American Semiconductor Equipment Industry Posts August 2013 Book-to-Bill Ratio of 0.98
- Plastic Electronics 2013: Deep Insight into an Industry on the Edge of Commercialization
- Leading Packaging and Test Experts to Gather at SEMICON Europa 2013
- Ready for Prime Time? Manufacturability and Commercialization Take Center Stage at Plastic Electronics 2013
- European Path to 450mm and Next-Generation Fab Highlights 2013 SEMICON Europa
- SEMI Reports Second Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings US$ 7.55 Billion
- SEMICON Europa to Rotate Between Dresden and Grenoble Beginning in 2014
- September Issue of SEMI Global Update Now Available
- Next Level of MEMS Industry Development to be Examined at SEMICON Europa
- European 3D TSV Summit: “Application Ready” Theme to Focus on Both Business and Technology Aspects
- Fab Equipment Spending Up 25% in 2014
- North American Semiconductor Equipment Industry Posts July 2013 Book-to-Bill Ratio of 1.00
- August Issue of SEMI Global Update Now Available
- Market and Technology Drivers to Bring 3D-IC to Production
- Increase in Second Quarter 2013 Silicon Wafer Shipments
- SEMI Commends U.S. Senators Brown and Blunt for Bipartisan Problem-Solving and Introduction of Advanced Manufacturing Bill
- SEMI Networking Day – Italy Event to Focus on Latest Advances in MEMS Technology
- SEMI Congratulates Applied Materials’ Mike Splinter on Receiving 2013 SIA Robert N. Noyce Award
- North American Semiconductor Equipment Industry Posts June 2013 Book-to-Bill Ratio of 1.10
- SOLARCON® India 2013 to Focus on Need for Complete PV Ecosystem in India — ahead of JNNSM-Phase II Announcements
- SEMI Announces Vietnam Semiconductor Strategy Summit
- Waves of Change in Advanced Electronics Materials to be Explored at SEMI Strategic Materials Conference 2013
- Solid State Technology and SEMI Announce 2013 “Best of West” Award Winner
- SEMI Standards Honors Industry Leaders at SEMICON West 2013
- Continued Strength of Taiwan's Semiconductor Market on Display at SEMICON Taiwan 2013
- SEMI Announces Results of Board Elections and Leadership Appointments
- SEMI Sees 21% Increase in Chip Equipment Spending for 2014
- July Issue of SEMI Global Update Now Available
- SEMI Releases 1Q’13 Worldwide Photovoltaic Equipment Market Statistics Report
- Governor Cuomo Announces Partnership Between Nikon and SUNY’s Nanocollege Leads to $350 Million Investment and Over 100 High Tech Jobs
- SEMI Recognizes Ajit Manocha, CEO of GLOBALFOUNDRIES, for Environment, Health and Safety Leadership
- SEMICON West 2013 Highlights
- SEMICON Europa to Provide Access and Opportunity into €100 Billion European Semiconductor Strategy
- Solid State Technology and SEMI Announce 2013 “Best of West” Award Finalists
- Latest Manufacturing Innovations in MEMs, LEDs, Silicon Photonics, and Printed/Flexible Electronics Featured at SEMICON West
- North American Semiconductor Equipment Industry Posts May 2013 Book-to-Bill Ratio of 1.08
- SEMI Reports First Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings US$ 7.31 Billion
- Materials Effect on Long-Term PV Quality— Addressed at SEMI PV Materials Expert Forum at Intersolar North America
- June Issue of SEMI Global Update Now Available
- Fab Equipment Spending: Strong Second Half Pulls 2013 Up; over 23% Growth for 2014
- EU Goal: Reach 20% World-Share in Chip Manufacturing by 2020
- Test Vision 2020 to Address Emerging Test Strategies, Technologies, and Application Challenges
- SEMICON Russia 2013 Opens Next Week; Spotlight on Latest Developments of the Russian Microelectronics Sector
- President Obama Visits Applied Materials in Austin
- North American Semiconductor Equipment Industry Posts April 2013 Book-to-Bill Ratio of 1.08
- May Issue of SEMI Global Update Now Available
- Slight Decrease in First Quarter 2013 Silicon Wafer Shipments
- SEMI Applauds President Obama’s Planned Visit to Applied Materials in Austin
- SEMICON Singapore 2013 to Spotlight Trends and Challenges in Technology and Workforce Development
- PV Manufacturing “State of the Union” Addressed at 4th Annual SEMI North American PV Fab Managers Forum at Intersolar North America
- Semiconductor Industry to Recognize Philip Yeo and Lee Kok Choy at SEMICON Singapore 2013
- Focus of SEMI Europe Networking Day: Embedded Packaging Technologies Enabling Product Differentiation
- Critical Updates from Industry Leaders on EUV, 3D Transistors and 450mm Manufacturing Targeted for SEMICON West 2013
- SEMI Releases 4Q’12 Worldwide Photovoltaic Equipment Market Statistics Report
- North American Semiconductor Equipment Industry Posts March 2013 Book-to-Bill Ratio of 1.14
- SEMICON Russia 2013 Highlights Opportunities in Russia
- Semiconductor R&D: A State of Transition
- SEMI Technology Symposium Call for Papers Now Open— Held at SEMICON Japan 2013
- April Issue of SEMI Global Update Now Available
- Memory, Foundry, and LED Markets Drive Fab Spending in Southeast Asia
- SEMI Reports 2012 Global Semiconductor Materials Sales of $47.1 Billion
- Four PV Industry Leaders in Europe Honored for Standards Accomplishments
- North American Semiconductor Equipment Industry Posts February 2013 Book-to-Bill Ratio of 1.10
- New International PV Technology Roadmap Updates Path towards Continuous Solar Cost Reduction
- Critical Process Technologies and Fab Productivity Addressed at Upcoming Semiconductor Manufacturing Conference
- SEMICON West 2013 Spotlights Industry R&D Challenges and Opportunities
- SEMI Members and other Leading High-Tech Executives Urge President Obama and Congress to Enact High-Skilled Immigration Reform
- SEMI Reports 2012 Global Semiconductor Equipment Sales of $36.9 Billion
- March Issue of SEMI Global Update Now Available
- Fab Equipment Spending: Flat in 2013; Up 24% in 2014
- SEMI Calls for Constructive Action on Solar Trade Dispute
- Single European Semiconductor Strategy on the Way
- Semiconductor Industry Leaders Contemplate Region's Future at ISS Europe 2013
- North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14
- Call for Papers Open for SEMICON Europa 2013
- SEMI Highlights Archive
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Industry News
Features
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