Events
Highlights
- SEMI Mourns Loss of Industry Veteran and Former SEMI Chairman James J. Greed
- SEMI Presents 2012 Government Leadership Award to House Ways and Means Chairman; Announces Two New Board Members at Washington Forum Event
- Slight Increase in First Quarter 2012 Silicon Wafer Shipments
- May issue of SEMI Global Update Now Available
- “Call for Papers” Open for Plastic Electronics 2012
- SEMICON West 2012 to Showcase Advances in LEDs, MEMS, and Plastic Electronics Manufacturing
- 3D-IC Opens a New Era of IC Packaging and Testing
- “Future of Electronics Innovation” Video Competition Winners Announced at SEMICON Singapore
- Growing the Young Talent Pool for the Semiconductor Industry: SEMI Singapore Signs MOU with Republic Polytechnic
- North American Semiconductor Equipment Industry Posts March 2012 Book-to-Bill Ratio of 1.13
- Advanced Semiconductor Manufacturing Conference Will Focus on Productivity and Technology Challenges
- PV Manufacturing Equipment Book-to-Bill Increases from Record Low, Reports SEMI
- SEMI Technology Symposium Call for Papers Now Open - Held at SEMICON Japan 2012
- Webinar: Intellectual Property Challenges to Innovation
- April Issue of SEMI Global Update Now Available
- SEMI Reports Record Revenues for the Global Semiconductor Materials Market — $47.86 Billion in 2011
- Leading-Edge Semiconductor Technology Featured at SEMICON West
- New International PV Roadmap Edition Released; Fischer and Metz Receive PV Group Award
- North American Semiconductor Equipment Industry Posts February 2012 Book-to-Bill Ratio of 1.01
- SEMI Statement on Department of Commerce Findings in Solar Trade Case
- Call for Papers Open for SEMICON Europa 2012
- SEMI to Address Packaging of 450mm Wafers and Panel Scale Technologies
- SEMI Reports 2011 Global Semiconductor Equipment Sales of $43.53 Billion
- SEMI Advocates Bold Action to Expand U.S. Solar Manufacturing
- SEMI and SSIA Launch the Electronics Young Talent Outreach Program
- March Issue of SEMI Global Update Available
- Equipment Spending Growth Flat in 2012; Record Fab Equipment Spending Expected for 2013
- FPD China 2012 at the Crossroads of Dynamic Changes in the Global Display Industry
- SEMI Acquires Plastic Electronics Conference and Exhibition
- North American Semiconductor Equipment Industry Posts January 2012 Book-to-Bill Ratio of 0.95
- SEMICON China to Focus on Technology Challenges and New Opportunities in Semiconductor and Emerging Markets
- Global Industry Leaders Converge on SOLARCON China 2012
- Opportunities for China's IC Supply Chain Development Showcased at Upcoming SEMICON China 2012
- Leading Manufacturers Collaborate to Update the "International Technology Roadmap for Photovoltaics"— Moving the Industry Forward
- Upcoming SEMI Europe Symposium to Confront IC Industry Challenges
- SEMI Global Update: February 2012 Issue Now Available
- Silicon Wafer Revenues Up in 2011
- SEMI Expresses Condolences for Loss of Steve Appleton
- The Semiconductor Industry Has Lost a Hero
- LED Korea 2012 to Showcase Latest Technology Trends, Applications and Manufacturing Solutions for High-Power LEDs
- North American Semiconductor Equipment Industry Posts December 2011 Book-to-Bill Ratio of 0.88
- With Highest Fab Equipment Capex Forecasted for 2012, Korea is Ready for SEMICON Korea— Slated for February 7-9
- December 2011 SEMI Book-to-Bill Rescheduled
- QD Vision Receives the SEMI Award for Quantum Dot Research
- Economic Outlook and New Models of R&D Efficiency Debated at SEMI Industry Strategy Symposium 2012
- SEMI Honors G. Dan Hutcheson with Bob Graham Award for Marketing and Sales Excellence
- SEMI Global Update: January 2012 Issue Now Available
- Stanley Myers Named Director Emeritus of SEMI
- Fab Spending Down in 2012— Dip in First Half, but by Mid-Year Recovery Begins
- LED Fab Equipment Spending to Decline 18% in 2012
- North American Semiconductor Equipment Industry Posts November 2011 Book-to-Bill Ratio of 0.83
- Semiconductor Packaging Materials Market to Reach $25.7 Billion by 2015
- SEMI Releases Third Quarter 2011 Worldwide Photovoltaic Equipment Market Statistics Report
- SEMI Reports Third Quarter 2011 Worldwide Semiconductor Equipment Figures; Billings US$ 10.6 Billion
- SEMI Announces “Call for Presenters” for SEMICON West 2012
- Semiconductor Equipment Sales to Reach $41.8 Billion in 2011
- Power Semiconductor Technology Webcast Now Available
- North American Semiconductor Equipment Industry Posts October 2011 Book-to-Bill Ratio of 0.74
- Taiwan-initiated Solar Panel Shipping Standard Garners International Approval
- Top Executives to Address “The Power of Asia” at SEMICON Japan 2011
- SEMI Statement on Recent Solar PV Trade Developments
- Slight Decline in Third Quarter 2011 Silicon Wafer Shipments
- Widening the Solar Value Chain: SOLARCON India 2011 Kicks Off on November 9 in Hyderabad
- SEMI Global Update: November Issue Now Available
- North American Semiconductor Equipment Industry Posts September 2011 Book-to-Bill Ratio of 0.75
- 450 mm Development Cost: $25 to $40 Billion
- SEMI Announces Silicon Wafer Shipment Forecast
- Christian Prischmann from Ulbrich Receives SEMI Europe Standards Leadership Award 2011
- Heinz Kundert Receives IC Industry Award for Leadership
- Tibor Pavelka Honored with European SEMI Award 2011
- SEMI Releases Worldwide Photovoltaic Equipment Market Statistics Report
- SEMI Announces Formation of India SSL Special Interest Group
- North American Semiconductor Equipment Industry Posts August 2011 Book-to-Bill Ratio of 0.80
- Advanced Manufacturing Technologies in the Spotlight at SEMICON Europa 2011
- Perspectives on 450mm
- SEMI Global Update: September Issue Now Available
- SEMI Recognizes Dr. Morris Chang for Environmental, Health and Safety Leadership
- SEMI Reports Second Quarter 2011 Worldwide Semiconductor Equipment Figures; Billings US$ 11.92 Billion
- Fab Equipment Spending up 23% in 2011— Still Highest on Record
- SEMI India Welcomes New Guidelines for National Solar Mission Grid-Connected Solar Power Projects
- North American Semiconductor Equipment Industry Posts July 2011 Book-to-Bill Ratio of 0.86
- Dennis P. McGuirk Named President and CEO of SEMI
- 3D-IC Opens a New Era of Packaging and Testing
- SOLARCON India Partners with IIT Bombay to Launch Inaugural Solar Technical Training in India
- SEMI Releases China LED Fab Industry Report
- SEMI Co-Sponsors Conferences Addressing Known Good Die (KGD) and 3D Packaging Challenges
- Increase in Second Quarter 2011 Silicon Wafer Shipments
- SEMI Global Update: August Issue Now Available
- North American Semiconductor Equipment Industry Posts June 2011 Book-to-Bill Ratio of 0.94
- SEMICON West 2011 Coverage
- SEMI Standards Awards Honor Five Industry Technologists
- SEMI Publishes New Photovoltaic Standard for Silicon Feedstock
- SEMI Announces Mid-year Consensus Forecast for Chip Equipment Industry
- Doug Neugold Named SEMI Chairman; Miller and Tong Elected to SEMI International Board
- Solid State Technology and SEMI Announce 2011 “Best of West” Award Finalists
- IC Packaging Innovation Increasingly Replacing Moore’s Law in Mobile Electronics Competition
- New TechZONE at SEMICON West Explores Cross-Supply Chain Collaboration
- Roadblocks for Critical New Microelectronics Manufacturing Technologies Confronted at SEMICON West 2011
- SEMI India PV Advisory Committee Tackles JN-NSM Implementation Challenges
- North American Semiconductor Equipment Industry Posts May 2011 Book-to-Bill Ratio of 0.97
- SEMI Reports First Quarter 2011 Worldwide Semiconductor Equipment Figures; Billings US$ 12 Billion
- Japan Semiconductor Industry Responds Successfully to Earthquake/Tsunami Crisis
- SEMI Forecasts 31% Rise in Equipment Spending and 9% Manufacturing Capacity Increase in 2011
- Second US PV Fab Managers Forum to Focus on Thin-Film Manufacturing
- SEMI PV Group and VDMA Release Global PV Manufacturing Equipment Book-to-Bill Report
- Crisis Planning and Preparation Speeding Japan Semiconductor Recovery
- North American Semiconductor Equipment Industry Posts April 2011 Book-to-Bill Ratio of 0.98
- ASMC: Approaching Device Scaling, Manufacturing Challenges with Partnerships
- ASMC: Rain Doesn't Damper the Spirit
- Slight Decline in First Quarter 2011 Silicon Wafer Shipments
- ATE Vision 2020 Conference Addresses Mid- and Long-term Critical Technology Issues in Semiconductor Test
- Manufacturing Innovations in HB-LEDs, MEMS, Printed Electronics Featured at SEMICON West 2011
- SEMI President and CEO Stan Myers Announces his Retirement
- SEMI and CPIA Release New Recommendations for China PV Policy Roadmap
- SEMI Forms Alliance with Korean University
- North American Semiconductor Equipment Industry Posts March 2011 Book-to-Bill Ratio of 0.95
- PVJapan 2011 Postponed to December 5-7
- ATIC, CEA-Leti, CNSE and Intel to Discuss Semiconductor Manufacturing Collaboration at ASMC 2011
- Secondary Equipment Market Reaches $6.0 Billion in 2010, according to New SEMI/Semico Study
- Driving Fab Efficiency, Emerging Applications Are Focus of Upcoming SEMICON Singapore
- SEMI Honors Congressman Michael McCaul for Government Leadership
- Aggressive LED Fab Investment Drives 40% Growth in Equipment Spending in 2011
- Critical Cost Reduction Targets - Identified in the International Technology Roadmap for Photovoltaics - Released by SEMI and CTM Group
- SEMI Reports 2010 Global Semiconductor Materials Sales of $43.55 Billion
- SEMI Establishes Fund for Japan Relief Efforts
- China Semiconductor Technology International Conference (CSTIC) 2011 Successfully Held in Shanghai
- Global Supply Chain Responds to Japan Crisis
- North American Semiconductor Equipment Industry Posts February 2011 Book-to-Bill Ratio of 0.87
- Japan Earthquake Stuns Semiconductor Industry
- IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Will Be Held in New York for First Time
- SEMI Reports 2010 Global Semiconductor Equipment Sales of $39.5 Billion
- Converging Technology Revolutions Take Center Stage at SEMICON West 2011
- Record Capex Leads to Fab Equipment Increase of 28% in 2011
- President Barack Obama Sees Atoms on FEI TEM
- SEMI HB-LED Manufacturing Webinar on March 2 Will Focus on Front End
- Global FPD Conference Tackles Key Issues in a Competitive Landscape
- North American Semiconductor Equipment Industry Posts January 2011 Book-to-Bill Ratio of 0.85
- Industry Experts Join Forces at SEMICON China to Prepare for Big Opportunities in Semiconductor and Emerging Markets
- Premier FPD China Event Focuses on How the Industry Can Meet Soaring Demand
- Fab Managers Convene to Address Critical Issues at Upcoming PV Forum in Berlin
- Silicon Wafer Shipments Reach Record Levels in 2010
- Tremendous Growth Opportunities in the PV Materials Market
- Paul Hyland Joins the SEMI Europe Advisory Board
- LED Korea 2011: A Success with New Technology, Latest Products, and Industry Collaboration Featured
- Morgan, Teng and Wilhoit Appointed to SEMI Singapore Regional Advisory Board
- “Call for Papers” Open for 7th Advanced PV Manufacturing Forum
- North American Semiconductor Equipment Industry Posts December 2010 Book-to-Bill Ratio of 0.90
- ISS Keynoter Mark Durcan on Leveraging Capital in M&A, DRAM Strategy
- ISS/SMC 2011: The Future for Memories, Materials, Stocks, and CEOs
- ISS 2011: Cleantech, LEDs, Capital Efficiency, Setting 2011 Expectations
- Micron COO Sees Mixed Memory Demand
- Economic and Analyst Predictions from ISS 2011
- Tragedy in Arizona
- SEMI Award for North America Given to Thomas DiStefano, John W. Smith, Jr. and Michael Warner for Chip Scale Packaging Technology
- SEMI Global Update: January Issue Now Available
- Debasish Choudhury Named President of SEMI India
- Third Quarter 2010 Worldwide Semiconductor Equipment Figures; Billings US$11.1 Billion
- SEMICON Korea 2011 Set to Open January 26
- Third Annual Solar Exhibition SOLARCON Returns to India in 2011
- Fab Capacity Back in the Black: Up 8% Annually
- SEMI International Standards Program Forms 3D Stacked IC Standards Committee; Call for Task Force Volunteers
- Call for Presenters for SEMICON West 2011
- Semiconductor Equipment Sales to Reach $37.5 Billion in 2010
Featured Video
View the winning videos from the "Future of Electronics Innovation Video Competition" from SEMICON Singapore 2012 
Industry News
Features
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SEMI Global Update Available | ||
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May issue: Silicon Reclaim Wafer Market; Photomask Market; SSL Economics; 3D-IC; IP Challenges; Materials (CGMG); Video Competition Winners; Intel Supplier Awards; PV Manufacturing Equipment Book-to-Bill | ||
| SEMI Membership Benefits | |||
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SEMI serves its members and the industries it represents through programs, initiatives, and actions designed to advance business and market growth worldwide. | ||
| Quarterly Report to Members | |||
 | The Quarterly Report to Members summarizes key SEMI milestones and accomplishments for the quarter. Organized by SEMI business unit, the Quarterly Report provides SEMI members a summary of the association's progress and results on key industry initiatives. | ||
| February 2012 Fab Database Published | |||
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The growth rate for fab equipment spending for 2012 is expected to improve from -12% to 0%. | ||
| PV Group | |||
 | Learn more about the SEMI PV Group efforts to lower photovoltaic manufacturing costs, connect global leaders, establish industry standards, and advance the latest crystalline and thin film technologies and solutions. | ||
| Industry Supplier Guide Provides Comprehensive Listing | |||
 | Comprised of approximately 7,000 listings spread over almost 1,000 categories, the directory provides a unique platform on which every semiconductor supplier across the industry spectrum can showcase their products and services, while customers can research multiple vendors all in one location. | ||
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