Fab Productivity and Process Technologies Addressed at Upcoming Semiconductor Manufacturing Conference
Manufacturers, suppliers and academia to celebrate 25 years of semiconductor manufacturing at SEMI event
SAN JOSE, Calif. — March 12, 2014 — The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York. The conference will feature 37 hours of technical presentations and 90+ speakers covering all aspects of advanced semiconductor manufacturing. This year’s event features a panel discussion on “25 Years of Semiconductor Manufacturing: Accomplishments, Current Challenges, Future Directions — From the Internet to the Internet of Things,” with panelists from SEMATECH, Rochester Institute of Technology, GLOBALFOUNDRIES, Qualcomm, and Applied Materials. A tutorial on directed self-assembly taught by Michael A. Guillorn, Ph.D., from the Nanofabrication and Electron Beam Lithography department at the IBM T.J. Watson Research Center, and a second tutorial, on Silicon Photonics, taught by Dr. Haisheng Rong, Intel Corporation.
Celebrating 25 years of manufacturing excellence in 2014, the SEMI Advanced Semiconductor Manufacturing Conference continues to fill a critical need in our industry. The conference provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The 2014 conference is co-chaired by Israel Ne'eman, Applied Materials, and Oliver Patterson, IBM Microelectronics. ASMC 2014 offers keynote talks by Dr. Been-Jon Woo from TSMC, and Dean Freeman from Gartner.
The topical areas ASMC 2014 speakers and poster presenters will address include
- Advanced Equipment and Materials
- Advanced Metrology
- Advanced Patterning/Design for Manufacturing
- Advanced Process Control (APC)
- Contamination Free Manufacturing (CFM)
- Data and Yield Management; Defect Inspection
- Equipment Reliability and Productivity Enhancement
- Factory Optimization
- Yield Enhancement
ASMC also holds an interactive poster session and reception, which provides an ideal opportunity for networking between authors and conference attendees. During this session, participants can engage authors in in-depth discussion of a wide range of issues.
ASMC 2014 is presented by SEMI with technical sponsors: Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Components, Packaging and Manufacturing Technology Society (CPMT). Corporate sponsors include: Applied Materials; ASML; ChemTrace; CNW Courier Network; Edwards Vacuum; Greene,Tweed; KLA-Tencor; Lam Research; Marcy NanoCenter; NY Loves Nanotech; and Saratoga Convention and Tourism Bureau.
Registration for ASMC 2014 is available at www.semi.org/asmc2014. For more information contact Margaret Kindling at firstname.lastname@example.org or phone 1.202.393.5552. Qualified members of the media should contact Deborah Geiger (SEMI Public Relations) at email@example.com for media registration information.
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
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