Semiconductor Manufacturing: ASMC 2014 Offers Visibility and Opportunity for Presenters — Deadline November 28
Learn and share knowledge while increasing your company’s prominence
SAN JOSE, Calif. — November 12, 2013 — SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28. ASMC, which takes place May 19-21, 2014 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “25 Years of Semiconductor Manufacturing,” moderated by Paul Werbaneth, 3D InCites, technical sessions on advanced semiconductor manufacturing, a keynote by TSMC, and tutorials on Silicon Photonics offered by Intel and Directed Self Assembly by IBM.
ASMC, celebrating 25 years of excellence, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. Selected speakers have the opportunity to present in front of IC Manufacturers, Equipment Manufacturers, Materials Suppliers, Chief Technology Officers, Operations Managers, Process Engineers, Product Managers and Academia. Technical abstracts are due November 28, 2013.
SEMI is soliciting technical abstracts in key technology areas.
- Advanced Metrology
- Advanced Equipment Processes and Materials
- Advanced Patterning / Design for Manufacturability
- Advanced Process Control
- Contamination Free Manufacturing
- Data Management and Data Mining Tools
- Defect Inspection and Reduction
- Discrete and Power Devices
- Enabling Technologies and Innovative Devices
- Equipment Reliability and Productivity Enhancements
- Factory Automation
- Green Factory
- Industrial Engineering
- Lean Manufacturing
- Packaging and Through Silicon Via
- Yield Enhancement/Learning
- Yield Methodologies
Complete descriptions of each topic and author kit can be accessed at www.semi.org/en/node/asmc2014. If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at email@example.com or call 1.202.393.5552.
Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are encouraged. To submit an abstract, visit http://semi.omnicms.com/semi/asmc2014/collection.cgi
Technical abstracts are due November 28, 2013.
SEMI is the global industry association serving the nano-and microelectronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
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