November 2010

In This Issue

From the SEMI Europe President: Russia Heats Up with RUSNANO and Cool LEDs

Fab Investments Planned for Japan

450 mm Wafer Transition

Protecting Semiconductor Equipment IP Rights

Taiwan Takes Its Place Among Industry Leaders

Foundry/Assembly Partnerships Move the Industry Forward in TSV Technology

Printed Electronics: a "Game Changing" Technology

Updated SEMI Safety Guidelines Address Multiple Issues

From the SEMI® Europe President

Heinz Kundert, President, SEMI EuropeRussia Heats Up with RUSNANO and Cool LEDs

First, a quick report: SEMICON Europa 2010 was a success with 350 exhibitors, 180 speakers, and 7,500 people in attendance! According to the survey, exhibitors were really satisfied with the event: 90 percent stated that they were "able to reach their most important target groups at SEMICON Europa." We also received excellent feedback to help us plan for an even better SEMICON Europa 2011. For details, click here.

Going eastward, I would like to mention the Russian Corporation of Nanotechnologies (RUSNANO) event taking place this week. SEMI was invited to organize the session on "Building-up a Russian Semiconductor Ecosystem" one of 22 sessions at the event. More than 10'000 attendees are expected to attend the overall event, which is the biggest conference in Russia about advanced manufacturing. The event takes place under the umbrella of Russian President Medvedev who will be in attendance. (more)

Heinz Kundert

ISS Europe 2011
"Europe -- Exploiting its Strengths"

27 Feb-1 Mar 2011, Grenoble, France

Fab Investments Planned for Japan
By Dan Tracy, SEMI Industry Research and Statistics
The semiconductor industry has seen many changes over the past decade, with the pace of change accelerating as a consequence of the recent financial crisis. Japan remains the country with the largest installed fab capacity base and is the largest market consuming semiconductor materials.

450 mm Wafer Transition
By Jonathan Davis, president, Semiconductor Business Unit
The transition of semiconductor manufacturing to 450 mm wafers is a challenging issue in our industry. Advocates claim larger wafers are necessary to keep pace with Moore's Law; opponents claim it will restructure the industry, negatively impact profitability, and drain R&D funding.

Protecting IP for Semiconductor Equipment
Using Section 337 Investigations at the U.S. ITC to Protect IP Rights relating to Semiconductor Equipment
By Gary Hnath, Mayer Brown
Semiconductors are the heart of most technological progress in the last few decades, and the equipment used to test and manufacture semiconductors is critical. This article explores how companies can use Section 337 investigations at the U.S. International Trade Commission to protect IP rights.

Taiwan Takes Its Place Among Industry Leaders
By Bettina Weiss, executive director, PV Group
Taiwan's high-tech industry is one of the great success stories in the world economy, with companies that are leaders in manufacturing in key categories such as flat panel displays, computer chips, routers, notebook computers, and now PV.

SEMI Europe welcomes new members:
S3 Alliance GmbH, solar-semi GmbH, Sico Technology

Foundry and Assembly Partnerships Move the Industry Forward in TSV Technology
By E. Jan Vardaman, TechSearch International, Inc.
Performance requirements such as increased bandwidth, reduced latency, and lower power are driving the adoption of 3D ICs designed with TSVs. The relationships between the foundry and the semiconductor assembly and test (OSAT) service providers are becoming increasingly critical as the industry moves toward 3D integration.

Printed Electronics: a "Game Changing" Technology
By Harry Zervos, technology analyst, IDTechEx
Printed electronics are here! We are witnessing the appearance of new products in the marketplace, and some use "game changing" technologies. IDTechEx expects the Printed Electronics market to grow to more than $50 billion over the next ten years

Updated SEMI Safety Guidelines Address Multiple Issues
The EHS Committee approved significant changes to criteria for conformance findings in SEMI S2 and a major rewrite of its guideline for evaluation of equipment (SEMI S7).


Europe Events
ISS Europe
27 Feb - 1 Mar 2011

31 May-1 Jun 2011

Intersolar Europe
8-10 Jun 2011

Asia Events
Beijing International Microelectronics Symposium
November 4-5

SEMI Japan Standards Meetings
November 14-17

December 1-3

SEMICON Korea 2011
January 26-28

LED Korea 2011
January 26-28

North America Events
International Trade Partners Conference
November 8-10

North America Fall Standards Meetings
November 8-11

ISS 2011: Role of Capital Efficiency Through Cycles
January 9-12

SMC 2011: Material Innovation: Catalyst for Success
January 12-14

Combating Aggressive Supply Chain Mgmt

Call for Papers
ASMC 2011

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Carlos Lee
Content Manager, SEMI Europe
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