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In This Issue
Mid-Year Update for Semiconductor Equipment and Materials
Keeping Up with Moore's Law: 3D ICs and TSVs
SEMI Standards Update on 450mm Activities
CMP Suppliers Face a Long-Lasting Shakeup from the Recession
China IC Industry Development Targets Renewed and Repurposed Fabs
NIL Plus Self Assembly Equals Low-Cost Patterning
SEMI PV Group and Intersolar Announce Partnership in China
Worldwide LED Investment Momentum to Continue into 2011
Startups Propose Disruptive Technologies to Improve HB LED Performance
Sharply Falling MEMS Prices Spur Rising Demand
Solar Module Added to High Tech U Program
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Mid-Year Update for Semiconductor Equipment and Materials
By Daniel Tracy, SEMI Industry and Statistics
Capital spending across the semiconductor industry is undergoing a sharp upward recovery this year -- off of deep lows reported in 2009.
Keeping Up with Moore's Law: 3D ICs and TSVs
By James Amano, SEMI
Three-dimensional integrated circuits (3D ICs), composed of a stack of two-dimensional die, are increasingly cited as being part of the solution to the semiconductor industry keeping pace with Moore's Law.
SEMI Standards Update on 450mm Activities
The SEMI Standards program sees increasing document development activities related to 450mm-related standards.
This issue is sponsored by:
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Advanced Technology Network is the world's premier media network serving the advanced technology marketplace. It links the individual media properties of Webcom Communications into a combined media platform of publications, events, online media and data products serving advanced technology markets worldwide.
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CMP Suppliers Face a Shakeup from the Recession
By Aaron Hand
As the semiconductor equipment and materials industries rise again from the ashes of the latest downturn, at least one area may continue struggling with the effects of the 2008-2009 recession until 2012.
China IC Industry Development Targets Renewed and Repurposed Fabs
China is taking advantage of the old generation fab lines worldwide, which meets the needs of China's semiconductor industry and enables cost-effective IC manufacturing.
NIL Plus Self Assembly Equals Low-Cost Patterning
By David Lammers
Nanoimprint lithography (NIL) and directed self-assembly techniques both appeared unlikely a few years ago. Now, these techniques are complementing each other.
LED Investment Momentum to Continue into 2011
By Clark Tseng, SEMI Industry Research and Statistics
With recent forecasts showing almost 30% revenue growth this year, the semiconductor market is headed to record highs for both revenues and units shipped.
SEMI PV Group and Intersolar Announce Partnership in China
SEMI PV Group and Intersolar have recently finalized their latest collaboration on organizing the world's leading solar-specific industry event in China, Intersolar China / SOLARCON China 2011.
Startups Propose Disruptive Technologies to Improve HB LED Performance at Lower Cost
By Paula Doe, SEMI Emerging Markets
Producing high-brightness LEDs with high enough light quality and low enough cost for a real volume market in solid state lighting is a tough challenge. But it creates a prime opportunity for startups who think "outside the box."
Sharply Falling MEMS Prices Spur Rising Demand
By Paula Doe, SEMI Emerging Markets
The MEMS market is poised for 24% unit growth this year, and for continuing steady 23% average annual growth though 2015, as demand explodes.
Solar Module Added to High Tech U Program
High Tech U reaches out to young people, including minorities and females. High Tech U opens eyes to career possibilities, and gives them confidence to pursue math and science courses.
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