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In This Issue
Equipment Sales Have Bottomed Out and Are Now Moving Up
Asian Foundries to Lead Capital Expenditure Recovery in Second Half
Announcing New SEMI EU Machinery Directive Working Group
SEMICON Europa 2009: Focused on Industry Needs
Test Summit Tackles the Issues
Lithography TechXPOT: the End of the Line for 193
Jobs More Important than Price per Watt for Key Policy Makers
MEMS-based Market to Generate $13 Billion Supply Chain Revenue in 2012
SEMICON Japan Nurtures Innovation with New Nanoimprint Area
PV Manufacturing Covered at EHS Symposium
3D IC Integration: SEMI Releases White Paper on Rapid Progress
Staying on Top of the Grant Opportunities
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From the SEMI® Europe President
 SEMI Europe represents member interests throughout the year working with policymakers from the European Commission and National Governments. In addition, we promote the opportunities offered by the EU to our members.
On 15 September, we are offering a free seminar on how to apply for EU funding. The seminar is targeted to semiconductor companies, especially SMEs. I encourage you to take advantage of this opportunity.
Heinz Kundert
www.semi.org/europe
Equipment Sales Have Bottomed Out and Are Now Moving Up
By George Burns, Strategic Marketing Associates
The most severe recession to hit the advanced industrial economies since the 1930s is bottoming out. Coincident with this is a turnaround in chip sales which will likely continue growing this year and next. As a result, equipment sales have turned around as well.
Asian Foundries to Lead Capital Expenditure Recovery in Second Half
By Clark Tseng, SEMI Taiwan Industry Research and Statistics
This year we witnessed a sharp decline in front-end fab equipment spending, a 26% decline from 4Q 2008 to 1Q 2009 to $3.2B worldwide. However, spending bottoms out in Q2 and we are starting to see signs of improvement from the entire supply chain.
Announcing New SEMI EU Machinery Directive Working Group
SEMI has informed its members that there is a revised and amended EU Machinery Directive (MD). The New EU MD 2006/42/EC, which becomes effective on December 29, 2009, will have an impact on the semiconductor industry.
SEMICON Europa 2009: Focused on Industry Needs
With the changing environment, the SEMICON Europa 2009 show and conferences (6-8 October) will be held for the first time in Dresden— and will focus on the real needs and challenges of the semiconductor industry in Europe
Test Summit Tackles the Issues
The Executive Test Summit at SEMICON West 2009 featured panelists from Advantest, LTX Credence, Teradyne, and Verigy. Rick Nelson, chief editor for Test & Measurement World and EDN moderated the panel.
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Semiconductor Packaging News
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Lithography TechXPOT: the End of the Line for 193
The life of 193 nm lithography has been extended many times; advances in OPC, water immersion, and double-patterning have allowed the semiconductor industry to use this technology down to the 32 nanometer node.
Jobs More Important than Price per Watt for Key Policy Makers
By Bettina Weiss, SEMI PV Group
A critical component in public policy advocacy efforts in support of solar power and PV manufacturing worldwide is the impact on employment. PV power creates jobs-- a critical asset in lobbying efforts.
MEMS-based Market to Generate $13 Billion Supply Chain Revenue in 2012
MEMS-based systems were a $46 billion business in 2008, and despite the recession should still see 12% compound average annual growth through 2012, burgeoning to an $83 billion industry.
SEMICON Japan Nurtures Innovation with New Nanoimprint Area
SEMI has announced the creation of an exhibit area dedicated to nanoimprint lithography (NIL) at SEMICON Japan 2009.
PV Manufacturing Covered at EHS Symposium
On July 16, SEMI EHS held an informational seminar on photovoltaic manufacturing at SEMICON West 2009 in San Francisco, California. Five key speakers presented their views.
3D IC Integration: SEMI Releases White Paper on Rapid Progress
Through Silicon Via (TSV) is a rapidly developing technology in the semiconductor industry, promising to shift the role of Moore’s Law and current multi-chip integration and packaging approaches. SEMI has released a white paper on the rapid progress of 3D IC integration technology, including TSV developments.
 Staying on Top of the Grant Opportunities
Many SEMI member companies may be interested in funding opportunities from the U.S. government. A wide range of programs is available and new sources of funding are coming on-line as agencies implement the economic stimulus bill.
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