 |
|
In This Issue
Oral History Interview: Julius Blank
Rebound! After a Tough 2007, Strong Growth for the TFT-LCD Market in 2008
World Fab Forecast Predicts Hitting Bottom in 2008—then Strong Rebound in 2009
Recovery and Restructuring
Advanced Processes and Materials at 32nm and 22nm Featured at SEMICON® West
LEAN Mean Manufacturing—Fab Efficiency at AMD
35 Years of Semiconductor Standards: Maximizing Value in a Challenging Industry Environment
Extreme Impact! High Tech U Alum More Involved and Aware
|
|
|
Oral History Interview: Julius Blank
Interviewed by Craig Addison, SEMI
Julius Blank was one of the Traitorous Eight who left Shockley Labs in 1957 to form Fairchild Semiconductor. For the next 10 years, he traveled the world setting up new manufacturing facilities to meet growing demand for transistors and ICs.
Rebound! After a Tough 2007, Strong Growth for the TFT-LCD Market in 2008
Special contributions by Charles Annis, DisplaySearch
By Edwin Hall, SEMI Industry Research & Statistics
Liquid Crystal Displays (LCDs) are everywhere. You see them on everything from cell phones, to navigational systems, to digital cameras/camcorders, to notebooks, to televisions, and even on refrigerators.
World Fab Forecast Predicts Hitting Bottom in 2008—then Strong Rebound in 2009
By Christian Gregor Dieseldorff, SEMI Industry Research and Statistics
Spending for fab equipping and constructing is expected to hit bottom soon. Taiwan shows strongest growth rates in 2009 followed by SE Asia. For the first time in history, 300mm capacity surpasses 200mm capacity.
Recovery and Restructuring
By George Burns, Strategic Marketing Associates
Recent sales finally show signs of improvement. In March 2008, the SIA three-month moving average of semiconductor sales climbed to $21 billion while the SEMI three-month moving average of equipment sales posted the largest monthly gain since July 2006.
|
FREE Webcast—
Innovation at Risk: Intellectual Property Challenges and Opportunities
June 17, 2008 @ 10:00 a.m. PDT
Executives from Cymer, Dupont IC Fab Materials, Nikon Precision, Tokyo Electron America and SEMI discuss mounting IP protection challenges, adverse economic consequences for the entire microelectronics industry, and potential solutions.
Register Now.
| |
Advanced Processes and Materials at 32nm and 22nm Featured at SEMICON West
Emerging requirements for new materials like high-k gate and capacitor dielectrics, low-k interlayer dielectrics, and engineered substrates has created the greatest period of change in semiconductor manufacturing in thirty years. At the same time, uncertainty abounds about the design flexibility, exposure tooling, cost, and manufacturing integration of lithography at the 22 nm node.
LEAN Mean Manufacturing—Fab Efficiency at AMD
Is it possible to save millions of dollars in one year by eliminating wasted time and resources across your manufacturing operations? Definitely, says Doug Grose of AMD.
35 Years of Semiconductor Standards: Maximizing Value in a Challenging Industry Environment
By Bettina Weiss, SEMI
How did SEMI grow a standards organization from nothing to an international program with 19 global technical committees and more than 200 task forces? What does it take to create and define the standards that reach across industries and technologies?
Extreme Impact! High Tech U Alum More Involved and Aware
If you've ever conducted a survey, you know that getting a 90% response rate is excellent. And having 100% of survey respondents state that the HTU program "positively influenced their lives" is even better—more than most sponsors hope for!
|
|
|
