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In This Issue
From the SEMI North America President
Equipment Sales Have Bottomed Out and Are Now Moving Up
Asian Foundries to Lead Capital Expenditure Recovery in Second Half
Test Summit Tackles the Issues
Lithography TechXPOT: the End of the Line for 193
Jobs More Important than Price per Watt for Key Policy Makers
MEMS-based Market to Generate $13 Billion Supply Chain Revenue in 2012
SEMICON Japan Nurtures Innovation with New Nanoimprint Area
PV Manufacturing Covered at EHS Symposium
3D IC Integration: SEMI Releases White Paper on Rapid Progress
Staying on Top of the Grant Opportunities
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From the SEMI® North America President
Up Periscope!
Deluged by the underwater economy, much of the industry has been swimming at depths not seen for a decade. So, it was good to see rising expectations at SEMICON West and in other recent news as people begin see encouraging signs above the waterline. IC Insights reports that the top 20 semiconductor companies collectively saw Q2 sales improve 21% over the first quarter of 2009. And our own mid-year SEMI Consensus Forecast, released last month at SEMICON West, projects capital spending to resume in 2010, with the global equipment market rising 47% to about $21 billion.
Speaking of SEMICON West, this year's event also bucked industry trends, with verified visitor attendance rising 4% to 17,801. Part of this increase comes from the growth of and interest in Intersolar North America and rising interest in the solar energy and PV markets, but growth is also reflected in the core semiconductor segments that are the hallmark of SEMICON West... (more)
Jonathan Davis
www.semi.org
Equipment Sales Have Bottomed Out and Are Now Moving Up
By George Burns, Strategic Marketing Associates
The most severe recession to hit the advanced industrial economies since the 1930s is bottoming out. Coincident with this is a turnaround in chip sales which will likely continue growing this year and next. As a result, equipment sales have turned around as well.
Asian Foundries to Lead Capital Expenditure Recovery in Second Half
By Clark Tseng, SEMI Taiwan Industry Research and Statistics
This year we witnessed a sharp decline in front-end fab equipment spending, a 26% decline from 4Q 2008 to 1Q 2009 to $3.2B worldwide. However, spending bottoms out in Q2 and we are starting to see signs of improvement from the entire supply chain.
Test Summit Tackles the Issues
The Executive Test Summit at SEMICON West 2009 featured panelists from Advantest, LTX Credence, Teradyne, and Verigy. Rick Nelson, chief editor for Test & Measurement World and EDN moderated the panel.
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Semiconductor Packaging News
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Lithography TechXPOT: the End of the Line for 193
The life of 193 nm lithography has been extended many times; advances in OPC, water immersion, and double-patterning have allowed the semiconductor industry to use this technology down to the 32 nanometer node.
Jobs More Important than Price per Watt for Key Policy Makers
By Bettina Weiss, SEMI PV Group
A critical component in public policy advocacy efforts in support of solar power and PV manufacturing worldwide is the impact on employment. PV power creates jobs-- a critical asset in lobbying efforts.
MEMS-based Market to Generate $13 Billion Supply Chain Revenue in 2012
MEMS-based systems were a $46 billion business in 2008, and despite the recession should still see 12% compound average annual growth through 2012, burgeoning to an $83 billion industry.
SEMICON Japan Nurtures Innovation with New Nanoimprint Area
SEMI has announced the creation of an exhibit area dedicated to nanoimprint lithography (NIL) at SEMICON Japan 2009.
PV Manufacturing Covered at EHS Symposium
On July 16, SEMI EHS held an informational seminar on photovoltaic manufacturing at SEMICON West 2009 in San Francisco, California. Five key speakers presented their views.
3D IC Integration: SEMI Releases White Paper on Rapid Progress
Through Silicon Via (TSV) is a rapidly developing technology in the semiconductor industry, promising to shift the role of Moore’s Law and current multi-chip integration and packaging approaches. SEMI has released a white paper on the rapid progress of 3D IC integration technology, including TSV developments.
 Staying on Top of the Grant Opportunities
Many SEMI member companies may be interested in funding opportunities from the U.S. government. A wide range of programs is available and new sources of funding are coming on-line as agencies implement the economic stimulus bill.
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Call for Papers
ASMC 2010 is now accepting abstracts for this respected manufacturing conference. For details, visit www.semi.org/asmc2010
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