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Smart and Efficient Supply Chain Integration with SEMI Standards

By Inna Skvortsova, SEMI

 

For over 30 years, industry experts have gathered at the annual Advanced Process Control (APC) conference to discuss state-of-the-art Industry 4.0/Smart Manufacturing solutions for high precision microelectronics manufacturing. These APC solutions include traditional methods of diagnostics and process control, such as Fault Detection and Classification (FDC) and Run-to-Run (R2R) control, that are now empowered by prediction technologies and capabilities of Big Data, ML, and AI.

Furthermore, the increasingly interconnected nature of microelectronics manufacturing today requires stakeholders to exchange data efficiently and securely, enabling end-to-end supply chain traceability within a single "digital thread " to realize the benefits of Smart Manufacturing and to achieve “zero defects” tolerance.

As the industry moves into an era where the microelectronics supply chain is becoming more complex and data driven, SEMI Standards Committees continue to develop solutions connecting diverse segments including wafer-processing, packaging & test, outsourced manufacturing and assembly, and EMS, by providing the industry with a holistic environment, common terminology and methodologies for effective and secure information exchange.

To improve microelectronics supply chain integration and enable smarter quality control, the SEMI Standards Traceability Committee recently developed a new standard, SEMI T23: Specification for Single Device Traceability for the Supply Chain. This specification provides an approach for traceable device-level identification throughout the IC manufacturing, test, and assembly processes to the point of use in the final system. SEMI T23 is applicable to different device configurations ranging from single integrated circuits to multi-chip/3D structures.

standards watch image dec 2019 trace

This new SEMI standard is intended for implementation by materials suppliers, device designers, device makers, board manufacturers, and system integrators from various industry sectors including semiconductor, automotive, and medical. The document defines the minimum requirements for device ID and traceability for new design and manufacturing implementation. The goal is to enable in-depth yield learning from silicon to final test when yield loss or a field failure occurs.

Building on SEMI T23’s capabilities, the Traceability Committee is now working on a proposal for a new standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain to provide secure and confidential authentication of parts as they flow between multiple segments of the supply chain.

This is a critical step to enable yield and reliability improvement, problem root cause analysis, recall containment, and liability protection as counterfeit parts represent a material risk to health, safety and security, especially for medical, defense, or automotive applications. The purpose of this standard is to enable detection of counterfeit or security risk parts as they flow within the supply chain.

This new standard proposal is based on a Hyperledger Fabric and Blockchain technology for recording the chain of custody of parts as they transition through the microelectronics supply chain. Root of Trust (ROT) is not covered by this standard but is an important part of the solution ecosystem.  Combined with ROT schemes in silicon, deployment of this new SEMI standard promises a drastic reduction in counterfeiting and security attacks.

To strengthen Smart Manufacturing capabilities supporting high-end packaging operations, another broadly adopted standard, SEMI E142: Specification for Substrate Mapping, is under revision to enable tighter quality control requirements for advanced packaging and assembly.

SEMI E142 defines the data items that are required to report, store and transmit map data for substrates such as wafers, frames, strips and trays. After this latest revision SEMI E142 will define additional substrate types (e.g., PCB and panels) and how the physical substrates can be aligned with the E142 map data. Revision will also include method for packaging raw materials traceability at the substrate and single device levels.

Lastly, SEMI E142 is instrumental as part of the solution for SEMI T23 single device traceability as well as for Counterfeit Prevention standards deployment.

The above noted SEMI Standards are just a few activities that were featured at the APC Conference this year. Technology experts from across the supply chain are encouraged to collaborate on these standards development efforts that are critical for the industry.

To summarize, the increasing complexity and rigorous quality requirements for advanced technologies has intensified the need for effective and efficient data exchange beyond front-end IC manufacturing to encompass the entire microelectronics supply chain. SEMI Standards can establish a universal foundation to increase transparency and reduce cost and complexity, enabling smart and efficient supply chain integration.

 

Get Involved

If you have any questions regarding the SEMI Standards mentioned in this article or would like to participate in standards development, please contact SEMI staff, Inna Skvortsova: [email protected]

SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.

 

Standards Watch
SEMI
www.semi.org
December 5, 2019