The Rudolph Yield Forum™ provides process engineers, fab managers and tool owners with new applicatino data and process control techniques that address current process challenges.
Introducing Dr. Yi-Sha Ku, ITRI, 3D Interconnect Metrology
New in 2011: LED Manufacturing Session Featuring guest speakers from Veeco, Laytec, Trend Force and Umetrics
LED industry outlook
Market trends, MOCVD equipment and process control
Techniques for yield improvement of the epitaxy process
In-situ monitoring of the MOCVD growth process
Using automated equipment monitoring to lower manufacturing costs
Virtual metrology in LED manufacturing
Benefits and challenges of advanced process control
Patterned inline inspection
Picosecond ultrasonics for automated LED process control
Semiconductor Sessions
Wafer Fab Session
Advances in SiGe:b process control using blue FBE
Inline metrology for amorphous carbon
Uniformity inspection technique for CMOS & CMP inspection
Backside defect characteristics
TSV inspection and metrology
Techniques for data mining across the supply chain
Advanced inspection applications for TSV
Waferless recipe creation challenges for 32nm and beyond
Virtual metrology for manufacturing
Assembly and Test Session
Performance of laser triangulation technology in 3D bump inspection
TSV inspection and metrology
Probe mark inspection and metrology solutions
Strategies for reduced review
Advanced inspection applications for TSV
Implementing fault detection and classification for advanced packaging
Wafer edge and backside inspection
Trends in back-end manufacturing
Registration opens at 8:30am; sessions close at 5:00pm.
To register or for more information: Contact: Judy Hsu, Rudolph Taiwan Email: mailto:amy.pauling@rudolphtech.com Tel: (886) 3 5169230 Ext 502
