啟動450mm時代 –

CEA-LETI、Ebara、Hynix、Intel、Renesas、TSMC 

分享領袖觀點

30位產業領袖、3場高峰座談、5場產業聯誼活動 盡在「ITPC 2011」

Global 450集團(Global 450 Consortium)最新宣布，將透過全供應鏈管理及合作，驅動下一波產業晶圓轉型。目前組織各項具體細節正在做最終定案，有鑑於此，SEMI 年度國際半導體產業高峰論壇「ITPC 2011」，特別邀請到制定ITRS技術藍圖及450mm推動先驅 - Intel技術策略總監Paolo Gargini，深度探討450mm技術。並舉辦高峰座談，由法國知名技術研究組織CEA-LETI和Ebara、Hynix、Intel、Renesas、TSMC等具全球領導地位的產業大廠，分享市場動態及企業450mm策略走向。

450mm相關議程 重量級講師 :

• Dan Armbrust, President & Chief Executive Officer, SEMATECH
 
• Paolo Gargini, Chairman, ITRS; IEEE and Intel Fellow, Director TechnologyStrategy, Intel
• Robert Bruck, Vice President, Technology Manufacturing Group, Intel
• SJ Hong, Senior Vice President, Head of Research & Development, Hynix
• Burn Lin, Vice President, Research & Development, TSMC
• Laurent Malier, Chief Executive Officer, CEA-LETI
• Hirohito Watanabe, General Manager, LSI Research Laboratory, Renesas Electronics
• Manabu Tsujimura, Director of the Board, Chief Technology Officer, Ebara

 更多精采主題

• 3D IC
• Scaling
• 供應鏈管理
• 技術挑戰
• 更多新議題
• 需求驅動力

 聆聽產業觀點

• NVIDIA技術副總裁John Chen : 從客戶端角度看與代工的合作。
• IBM 半導體產品暨服務副總裁Mark Ireland : 分享半導體產業面臨的挑戰與機會。
• Novellus董事長兼執行長Rick Hill : 主持高峰座談會，多方探討產業需求驅動力。
• Ebara技術長 Manabu Tsujimura : 主持高峰座談會，全觀面板技術面臨的困難及機會。

下列廠商今年皆將出席盛會

2011年11月6日 (星期日)

16:00–18:00

論壇報到

18:00–19:30

歡迎酒會 (晚宴)

2011年11月7日 (星期一)

早餐時光

08:30–08:45

開幕典禮

08:45–09:25

Collaboration from a Fab Customer’s Perspective
John Chen, Vice President, Technology, NVIDIA

09:25–10:00

Enabling a Collaborative Ecosystem: A New Approach to Foundry Design Enablement
Mojy Chian, Senior Vice President, Design Enablement, GLOBALFOUNDRIES

09:55–10:30

Memory Technology Roadmap and the Technical Challenges in the Future
Ho-Kyu Kang, Vice President, Samsung Electronics

10:30–10:50

中場休息

10:50–11:25

Vision of Future DRAM 
Yukio Sakamoto, President, Elpida Memory

11:25–12:00

Fueling a Smarter Planet: Semiconductor Industry Trends, Challenges and Opportunities
Mark Ireland, Vice President, Semiconductor Products & Services, IBM

12:00–13:30

午宴

13:30–14:05

Progress and Challenges for Industrialization of New Lithography Technologies
Eric Meurice, President, CEO & Chairman, ASML

14:05–14:35

Collaboration in R&D for Leading the Technology Roadmap
Joël Hartmann, Technology R&D Group VP; Director Advanced CMOS Logic & Derivatives Technologies, STMicroelectronics; SRDC Co-Director, ISDA

14:35–14:55

中場休息

14:55–16:30

Panel:  Industry Demand Driver: Consumer & Corporate Electronics, Infrastructure & Emerging Regions
Moderator: Richard Hill, Chairman of the Board & Chief Executive Officer, Novellus Systems
Panelists:  Robert G. Bowman, Managing Director, JP Morgan; Yoram Cedar, Chief Technical Officer & Executive Vice President, SanDisk Corporation; Peng Fang, CEO, JA Solar; Mark Ireland, Vice President, Semiconductor Products & Services, IBM

18:30–19:30

Reception

19:30–22:00

晚宴

早餐時光

08:30–09:05

Risks of Consolidation (Technological, Geographic, Corporate) Up and Down the Semiconductor Supply Chain
David Wilhoit, President & CEO, Siltronic Samsung Wafer

09:05–09:35

Dynamics in the LED Industry
Matthijs Glastra, Senior Vice President of Technology, Product Development and Operations, Lumileds 

09:35–10:00

Peng Fang, CEO, JA Solar

10:00–10:15

中場休息

10:15–11:30

3-11 Supply Chain Crisis Management:
Lessons Learned
Introduction: Aki Sekiguchi, Vice President, General Manager, Tokyo Electron
Panelists: Tetsuro Higashi, Chairman, Tokyo Electron; Atsuyoshi Koike, President, SanDisk Limited; Senior Vice  President, SanDisk Corporation; Kiyoshi Togawa, Senior Vice President, Executive Officer, Hitachi Chemical; Shozo Saito, Corporate EVP, CEO, Electronics Devices, Toshiba
Summary:  Nobu Koshiba, President, JSR Corporation

12:00

午宴

12:30

ITPC 高爾夫球聯誼賽

18:30–19:30

Reception

19:30–22:00

晚宴

早餐時光

08:30–09:05

Fast Forward: Finding New Common Ground in Process Technology R&D
Dan Armbrust, President & Chief Executive Officer, SEMATECH

09:05–09:50

People, Atoms and Wafers
Paolo Gargini, Chairman, ITRS; IEEE and Intel Fellow, Director TechnologyStrategy, Intel

09:50–10:00

中場休息

10:00–11:30

Panel:  Technology Challenges and Opportunities: Smaller (Advancing Moore’s law), Taller (3D Integration), Bigger (450mm)
Moderator: Manabu Tsujimura, Director of the Board, Chief Technology Officer, Ebara
Panelists:  Robert Bruck, Vice President, Technology Manufacturing Group, Intel; SJ Hong, Senior Vice President, Head of Research & Development, Hynix;  Burn Lin, Vice President, Research & Development, TSMC; Laurent Malier, Chief Executive Officer, CEA-LETI; Hirohito Watanabe, General Manager, LSI Research Laboratory, Renesas Electronics

11:30

閉幕典禮