SEMI - 封裝測試委員會
SEMI 台灣封裝測試委員會委員 | |
矽品精密工業股份有限公司 研發中心副總經理 馬光華 博士 | |
Education l Ph. D. / Material Science and Engineering; North Carolina State University, Raleigh, NC, USA (1992) l M. S. / Materials Engineering; Northeastern University, Boston, MA, USA (1986) l B. S. / Metallurgy &Material Engr; National Cheng-Kung University, Taiwan (1982) Experience Siliconware Precision Industries Co., Ltd. (SPIL), Taiwan 2010~Present l Vice President: Corporate Research and Development United Microelectronics Corporation (UMC), Taiwan 2000~2010 l Division Director: Corporate Marketing l Division Director, Exploratory Technologies-Advanced Technology Development (ATD): accountable for 28nm platform (SiON and HK&MG) and 65nm Silicon-On-Insulator (SOI) technology development; managing external research programs (SEMATECH-FEP/Litho/3DIC, and performed assessments of emerging technologies) l Deputy Division Director, Logic Development- ATD: technology project manager for 90nm/ 65nm, performed technical marketing; interfaced with IC design community for design kits delivery and DFM strategy setting l Department Director, Process Engineering- Integration, Fab 8D Wafertech LLC (now “A TSMC Company”), Camas, WA, USA 1998~2000 l Deputy Department Manager, Technology Development department l Section Manager, Process Engineering II department Institute of Microelectronics (IME), Singapore 1997~1998 l Member of Technical Staff in Deep Sub-micron IC (DSIC) program United Microelectronics Corporation (UMC) group, Hsinchu, Taiwan 1993~1997 l Section Manager; start-up team and Diffusion Process section, in the spun-off United Semiconductor Corporation (USC, now UMC’s Fab 8B) l Principal Engineer, start-up team and Diffusion/Implant Process, Fab 8A l Senior Engineer, Diffusion/Film process, Fab IC1 (4” fab) l Metals Industry R&D Center (MIRDC), Kaohsiung, Taiwan 1991~1993 | |
