SEMI 台灣封裝測試委員會委員

國立清華大學 

動力機械工程系

特聘教授

江國寧 博士

www.nthu.edu.tw

•  Education:

–        Ph.D., ME of Georgia Institute of Technology

–        M.S., ME of University of South Carolina

–        B.S. National Cheng Kung University

•  Experience:

–        Present:  - Director of National Center for High-Performance Computing

–        Present:  - Distinguished Professor, National Tsing Hua University

–        Present:  - Chairman of IMAPS - Taiwan

–        Present:  - Director, Advanced Packaging Research Center, NTHU

–        Present: Editor-in-Chief, IEEE Transactions on Components, Packaging and Manufacturing Technologies

–        ASME Fellow

–        Associate Editor, IEEE Transactions on Advanced Packaging

–        Associate Editor, Journal of electronic package － ASME Transactions

–        Associate Editor, Journal of Mechanics

–        IEEE Senior Member

–        Engineering Director of ERSO/ITRI (2003-2005)

–        Secretary-General of ASME Taiwan Section (2002-2005)

–        Chairman of Key Application Committee – ERSO/ITRI (2005)

–        Director of R&D Dividion, NCHC (1993-1998)

–        Board Member of IMAP (International Microelectronics and Packaging Society) - Taiwan

–        Board member of KingPak Technology Inc.

–        Board member of Argosy Research Inc.