Chipbond Technology Corporation

Established in 1997, Chipbond is a reputable OSAT with its headquarter located in Taiwan, six factories in Taiwan and a factory in Malaysia. Services include : Au Bumping, Solder Bumping, Cu-Pillar Bumping, RDL, wafer probe testing, WLCSP, FOSiP, COG, COP, COF and COF tape. Chipbond is the worldwide largest packaging and test full turn key service provider to the display driver IC industry.

頎邦科技成立於1997年，總部設立於台灣新竹科學園區。台灣有六個廠區，馬來西亞檳城也有一個廠區。 頎邦為全球知名的半導體封測公司，提供的服務項目包括：金凸塊、錫鉛凸塊、銅柱凸塊、RDL、晶圓測試、WLCSP、FOSiP、COG、COP、COF、COF tape。 頎邦是平面顯示器驅動IC行業全球最大的全方位封測服務公司。