電子商品在終端消費者的驅動下，在功能與速度的要求上不斷提升。不論是產品的外觀、功能、上市速度以及價位，都是決定產品成功與否的重要因子，因應這些需求，封裝產業因而扮演著更重要的角色以滿足這些終端市場的期望，尤其在材料的選擇上更與封裝技術的提升密不可分。

典型的半導體封裝材料有：

Organics substrates Leadframes Mold Compounds Underfill materials Bonding wires

Liquid encapsulants Solder balls Wafer level package dielectrics Thermal interface materials Die attach adhesives

相關專欄與報告

• January 2010 Global Leadrame Shipments (Feb 2010)
• Productivity Transfer Propels Further Growth of China Packaging Industry (Feb 2010)
• Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material (Jan 2010)
• Japanese Companies Continue to Dominate Packaging Materials Market (Jan 2010)
• Growing Packaging Materials Market under Pressure (Dec 2009)
• Plastic Packaging Materials Market to Reach $20.1 Billion by 2013 (Nov 2009)
• Trends in Advanced Packaging – TechSearch Inc. (Jul 2009)
• Leadframe Unit Shipments Trends Show Signs of Recovery (Apr 2009)
• Semiconductor Materials Post Record Revenue for Fourth Straight Year (Mar 2009)
• Strategic Materials Conference '08 - Packaging Materials Forecast (Jan 2008)
• Packaging Materials: Market Challenges and Opportunities (Oct 2007)

產品

	Global Semiconductor Packaging Materials Outlook 2009/2010 This report is a comprehensive market research study that examines semiconductor packaging technology trends. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2013 are presented.

	China Semiconductor Packaging Market Outlook This report provides an outlook of the semiconductor packaging industry in China as well as a summary of the packaging materials and equipment for this important market. The report also highlights the material and equipment supply chain in China. The report also includes a database or list of packaging companies, wafer bumping fabs, materials suppliers, and local equipment manufacturers in China.

	3D Integration: A Progress Report A Progress Report was created to help accelerate the adoption of 3D integration using TSV interconnect technology by identifying the crucial barriers preventing widespread acceptance. It offers a comprehensive snapshot of the progress made thus far, while also shining a light on what is left to be addressed before first market adoption, and then volume production can be achieved.
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