SEMI與產業共同合作以增進晶圓廠的產能，進而協助會員們維持長期成長與獲利。藉由解決產能相關議題，或是晶圓廠所面臨的機會，無論是晶圓大小或是技術節點，甚或是過渡到MEMS的製造等，半導體產業無不企圖尋求提高半導體晶圓廠的吞吐量、效能，以及在靈活性的最大運用。SEMI藉由產業技術標準、教育訓練，以及產業相關的組織團體的支援協助。

• Economic Realities Suggest a Long, Slow Road to 450 mm
• ISMI NGF e-Manufacturing Workshop on Dec 1 at SEMICON Japan
• Metrics-related Standardization and its Impact on Next Generation Semiconductor Industry
• A New Direction for Fab Productivity on Dec 3 at SEMICON Japan
• Advanced Wafer Tuning (SEMICON Japan)
• Impact of Wafer Geometry for Yield Improvement
• Equipment Life-Cycle Management (SEMICON Europa)
• Fab Agility and Productivity (SEMICON Europa)
• 450 mm in Europe-- Quo Vadis?
• Secondary Equipment Market Readies for New Era
• Standardizing Decontamination of Manufacturing Equipment
• New Dynamics Changing the Secondary Equipment Market
• Webcast Replay: 200/150 mm Fab Productivity--November 5, 2008
• SEMI Acquires SEC/N to Better Address 200 mm/ 150 mm Fabs 
• Industry to Address Energy Conservation at SEMICON Europa
• Next Step in the 450 mm Debate Scheduled for ITPC in November
• SEMI EPWG Releases Report on Economics of 450 mm Wafer Transition
• Secondary Market Exploding with 200 mm Equipment
• Special Event at SEMICON West: How to Breathe New Life into Old Fabs
• SEMICON West: Energy Conservation in the Semiconductor Industry: Obstacles and Opportunities (Co-Presented by SEMI and ISMI)

全球設備供應商團體(GESG)以成立並解決影響半導體產業的關鍵科技與商業議題。這個特殊利益團體的任務是為設備供應商提供一個問題解決的論壇平台，並統整全球的觀點與意見，來影響科技開發藍圖、設備製造廠與晶圓廠計畫、供應鏈合作及相關議題。(更多訊息)

EPWG匯集了產業的重要專家，他們與ISMI共同致力於多方的研究、分析與調查。