South Hall

Even as the world's largest IDMs anticipate the next node and wafer size transition, the vast majority of the industry sees opportunities in fab productivity, production flexibility and fab repurposing. Reducing cost, improving yield, increasing throughput, and expanding fab assets into "emerging" technologies and markets are just a few of the concepts that will be explored in these sessions.

10:30am–11:00am

Extreme Makeover – 2 Years Later
(Presentation in PDF)
Chris Magnella, Fab Manager
Freescale –MEMS

11:00am–11:30am

Productivity in Thin Film Head Manufacturing
(Presentation in PDF)
Erich Pokorny
Director of Procurement & Contracts
Western Digital

11:30am–12:00pm

Sub-Fab Solutions to Meet New GHG Regulations and Deliver Lower Energy Costs
(Presentation in PDF)
Phil Chandler
Applied Materials

12:00pm–1:00pm

Break

1:00pm–1:30pm

SESTG Secondary Market Data
(Presentation in PDF)
Tim Tobin
Vice Chair, SESTG & CEO
Entrepix

1:30pm–2:00pm

Leveraging 8” Semiconductor Fabs for Emerging Applications: Opportunities and Challenges
(Presentation in PDF)
David Anderson (Biography)
Vice President, Corporate Development
SVTC

2:00pm–2:30pm

Solution and Fabric for Electronic Industry
(Presentation in PDF)
Sohrab Kianian (Biography)
Vice President, Business Development & Licensing
Nantero

2:30pm–3:15pm

Fab Efficiency Panel
Dan Malinaric, Managing Director & Site Manager
Atmel
Bill C. Smoak, Vice President, Palm Bay Operations
Intersil
Brent Wilson, Vice President, Europe Wafer Fabs
ON Semiconductor
Moderator: LT Guttadauro, Executive Director
FOA