顧問

科林研發股份有限公司

亞太地區 總裁

廖振隆 先生

www.lamrc.com

Daniel Liao is President of Asia Pacific Operations of Lam Research Corporation, a leading global supplier of wafer processing equipments.

He joined Lam in 1993 as General Manager of Taiwan and South East Asia operations and was promoted to Vice President of Asia Pacific operation in 1997. In January, 2000, he was promoted to his current position at Lam and responsible for the regional operations in this fast growing Asia Pacific region.

Prior to joining Lam, he was engineering manager of both R & D and Fab engineering at IDT, Integrated Device Technology Inc. at San Jose, California from 1991 to 1993. He was engineering supervisor at IDT and responsible for Thin Film/Diffusion and Etch group from 1988 to 1991. Prior to joining IDT, he was sr. process Engineer of Technology Development dept at Intel in both Santa Clara and Livermore, California.

He received his Master degree of Electrical Engineering and Applied Physics from Case Western Reserved University, Cleveland, Ohio and Bachelor degree of Electrical Engineering from National Cheng-Kung University, Tainan, Taiwan.