SEMI - 封裝測試委員會

  

                                                        SEMI台灣封裝測試委員會主席


日月光集團

集團研發中心總經理暨研發長

唐和明 博士

www.aseglobal.com

Dr. Ho-Ming Tong joined the ASE Group in April, 2000, and is presently General Manager of Corporate R&D. Prior to joining the ASE Group; Dr. Tong had held several key management positions including General Manager of the Semiconductor Division of the First International Computer Group and Executive Vice President of Formosa Advanced Technologies. Both companies specialized in memory IC assembly and test pertaining to DRAM, Flash and SRAM.

Dr. Tong also served thirteen and a half years with IBM as Research Staff Member at Thomas J. Watson Research Center (IBM Research Headquarters) on advanced package development for mainframes and workstations and as Senior Engineering Manager at IBM’s East Fishkill Facility on advanced package and IC developments. Dr. Tong was elected IEEE Fellow for his leadership in leading-edge integrated circuit technologies. He was also a recipient of IBM Watson Research Division Award for his contributions on advanced packaging. Dr. Tong received his Ph.D., M.S. and M. Ph. degrees from Columbia University, and his B.S. degree from National Taiwan University, all in engineering. He has authored/co-authored 73+ patents, 100+ technical publications, and three books on electronic packaging.