Industry News Archive Provided by SEMI
Industry News Archives 2012
SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.
GlobalFoundries chips away at top spot National, The (United Arab Emirates)
(TMCnet.com, May 10)
Micron Wins Japan’s Elpida To Boost DRAM Lines To Asia
(International Business Times UK, May 07)
TriQuint wins $12.3 million DARPA contract
(EE Times, May 01)
GlobalFoundries, Infineon, IBM, ST linked to Indian fab plan
(EE Times, May 01)
Insight: As chip plants get pricey, U.S. risks losing edge
(International Business Times UK, May 01)
Worldwide Chip Sales May Grow at Faster Pace, IDC Says
(Bloomberg, Apr 30)
United States : GLOBALFOUNDRIES Fab 8 Adds Tools To Enable 3D Chip Stacking at 20nm and Beyond TendersInfo (India)
(TMCnet.com, Apr 27)
United States : GLOBALFOUNDRIES Fab 8 Adds Tools To Enable 3D Chip Stacking at 20nm and Beyond
(ElectroIQ, Apr 27)
Wearable electronics:Transparent, Lightweight, Flexible Conductor Could Revolutionize Electronics Industry
(Science Daily, Apr 27)
LED manufacturer Lumichip expands in Finland, opens development center
(ElectroIQ, Apr 27)
Cisco Wants 2.5D/3D Chips Sooner than Later
(Semiconductor Manufacturing & Design, Apr 27)
Denso To Take Over Fujitsu Semiconductor's Iwate Plant
(Nikkei.com, Apr 27)
AUO accelerates OLED production plans, sets up an R&D 6G line
(OLED-Info, Apr 27)
(TMCnet.com, Apr 27)
Intersolar North America launches new PV Production and Technology exhibition and program
(PV Magazine, Apr 27)
TSMC raises capex to record $8.5 billion, pulls in 20-nm
(EE Times, Apr 26)
MIT Researchers Invent 'Perfect Glass' [VIDEO]
(International Business Times, Apr 26)
GlobalFoundries Enters 2.5D/3D Chip Foundry Market
(Semiconductor Manufacturing & Design, Apr 26)
Japan semiconductor equipment firms gain share in 2011, says The Information Network
(Digitimes, Apr 25)
Applied Materials acquires new solar technology
(Digitimes, Apr 24)
KLA-Tencor tips new defect inspection system
(EE Times, Apr 23)
TI's sales top estimates as orders, inventory swell
(EE Times, Apr 23)
Semiconductor subsystems see record revenues thanks to 32nm and below
(ElectroIQ, Apr 23)
Equipment book-to-bill ratios diverge in U.S., Japan
(EE Times, Apr 23)
PV manufacturing equipment recovers from record low
(Pv Tech, Apr 23)
Semicon Europa sets out call for technical papers
(EE Times, Apr 23)
Japan: 51-cent FIT mooted
(PV Magazine, Apr 23)
North American semiconductor fab tool makers see March book-to-bill hike
(ElectroIQ, Apr 20)
TSMC's Chang Tips Hiking 2012 Capital Expenditure
(EMS Now, Apr 20)
PV Manufacturing Equipment Book-to-Bill Increases from Record Low, Reports SEMI
(EMS Now, Apr 20)
Texas Instruments (TI, TXN) names top suppliers
(ElectroIQ, Apr 19)
DRAM, foundry logic in race to use EUV, says ASML
(EE Times, Apr 19)
ASMC will focus on productivity and technology challenges
(ElectroIQ, Apr 18)
Intel, Micron on sub 20-nm and insatiable thirst for memory
(EE Times, Apr 18)
PV Manufacturing Equipment Book-to-Bill Improves in 4Q12
(PCB007 IConnect007, Apr 18)
Gartner: Worldwide semiconductor sales up $5.4 billion in 2011
(Information Technology World, Apr 17)
U.S.-based Companies Held 12 of the Top 25 Fabless Spots in 2011
(EMS Now, Apr 17)
TSMC 28nm ramp-up within expectations, says Digitimes Research
(Digitimes, Apr 17)
Intel awards 9 elite suppliers in 2011
(ElectroIQ, Apr 13)
Abu Dhabi, Saxony invest in 'twin labs' 3-D IC project
(EE Times, Apr 13)
Top 25 fabless IC companies in 2011
(ElectroIQ, Apr 12)
New frontier: Chips transfer data at light speed
(Nanowerk, Apr 12)
Pure-play foundry market to grow 12% in 2012, says IHS
(EE Times, Apr 12)
TSMC capex budget hike to benefit equipment and materials suppliers, say sources
(Digitimes, Apr 12)
Intel Honors 21 Companies with Preferred Quality Supplier and Achievement Awards
(TMCnet.com, Apr 11)
Semiconductor foundries expect double-digit growth through 2015
(ElectroIQ, Apr 11)
SEMI India re-iterates its commitment to skill development for the solar industry
(PRLog, Apr 11)
SEMI Calls for Papers for Symposium in Japan
(Semiconductor Manufacturing & Design, Apr 10)
Semiconductor wafer fab equipment trends: Deposition
(ElectroIQ, Apr 10)
Global Semiconductor Industry to Grow Significantly
(ElectroIQ, Apr 10)
Cambridge researchers claim plastic electronics breakthrough
(New Electronics, Apr 10)
India Semiconductor Spending To Reach $9.2 Billion In 2012: Gartner
(ElectroIQ, Apr 10)
Tackling GaN Measurement Challenges
(EE Times, Apr 09)
TSMC begins further expansion of Fab 14
(Digitimes, Apr 09)
ISPD: Semiconductors aim for 8-nm node
(EE Times, Apr 06)
On Semi, Qualcomm, Infineon shine in chip rankings
(EE Times, Apr 06)
Top 5 Most Counterfeited Parts Represent a $169 Billion Potential Challenge for Global Semiconductor Market
(EMS Now, Apr 06)
How to corner the MEMS market
(Phys.Org, Apr 05)
How to corner the MEMS market
(PhysOrg.com, Apr 05)
Global Semiconductor Sales Post $22.9 Billion in February
(EMS Now, Apr 05)
Costly shift to new wafers Times Union, Albany, N.Y.
(TMCnet.com, Apr 05)
Commentary: Diversifying a must for DRAM firms
(Digitimes, Apr 05)
Counterfeit electronic components hit record level in 2011
(New Electronics, Apr 04)
MEMS packaging market to reach USD2.3B by 2016, says Yole Developpement
(EE Times Europe Analog, Apr 04)
Scientists develop ultra-thin solar cells
(PhysOrg.com, Apr 04)
Report: Semiconductor IP market to double in five yearsl
(EE Times, Apr 03)
Chip sales slipped 1.3% in February, says SIA
(EE Times, Apr 03)
Samsung is betting on China with $7b semiconductor plant
(ElectroIQ, Apr 03)
SEMI Reports Record Revenues for the Global Semiconductor Materials Market -- $47.86 Billion in 2011
(ElectroIQ, Apr 03)
Samsung Spins Off Display Operations
(Twice, Apr 02)
Bend-it e-books get real with EPD in factory mode
(PhysOrg.com, Mar 30)
IC foundry market grows 5.1% in 2011, says Gartner
(Digitimes, Mar 30)
Cell equipment purchases to hit 35GW by 2017
(PV Magazine, Mar 30)
Breakthrough in semiconductor structuring
(Nanowerk, Mar 29)
TI adds bare die to small-quantity semiconductor packaging options
(ElectroIQ, Mar 27)
Intel semiconductor market share surges to more than 10 year high in 2011, IHS says
(Digitimes, Mar 27)
Interview: 450mm wafers key for Europe, says Imec chief
(Semiconductor Packaging News, Mar 26)
DNS Ponders Ice as New Wafer Cleaning Agent
(Semiconductor Manufacturing & Design, Mar 26)
Top MEMS suppliers near $1 billion in sales
(ElectroIQ, Mar 26)
Synopsys Unveils 3D-IC Initiative
(EE Times, Mar 26)
Fab tool book-to-bill above parity for first time in 16 months
(EE Times, Mar 23)
SEMI Statement on Department of Commerce Findings in Solar Trade Case
(EMS Now, Mar 23)
China hikes import tariffs for LCD panels
(Digitimes, Mar 23)
Analysis: China's IC industry likely to recover in Q2
(TMCnet.com, Mar 23)
United States : GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer
(ElectroIQ, Mar 22)
Nvidia: Intel Should Build Our Chips In Its Factories
(Forbes.com, Mar 22)
TSMC, Altera team on 3-D IC test vehicle
(EE Times, Mar 22)
Applied Materials readies DRIE machine for MEMS
(EE Times, Mar 22)
Japan's aging semiconductor industry revealed by 2011 earthquake
(ElectroIQ, Mar 20)
Japan February 2012 chip-gear orders down 5.7%, says SEAJ
(Digitimes, Mar 20)
New AIXTRON MOCVD Technology Center Supports China's Global LED Ambitions
(TMCnet.com, Mar 19)
AIXTRON opens MOCVD training center in China
(ElectroIQ, Mar 16)
TEL acquires advanced packaging tool supplier NEXX
(ElectroIQ, Mar 16)
Japanese Earthquake Disaster Strengthens Global MEMS Industry
(EMS Now, Mar 16)
Axcelis to Showcase Enabling Implant and Plasma Cleaning Solutions at SEMICON China 2012
(NewsBlaze, Mar 16)
Globalfoundries expects sales to AMD to increase
(EE Times, Mar 15)
TSMC and UMC Will Invest NT$200 B. in Southern Science Park
(EMS Now, Mar 15)
AU Optronics to appeal US price-fixing verdict
(PhysOrg.com, Mar 15)
Applied Materials losses top equipment supplier bragging rights
(Fabtech, Mar 14)
(Printed Circuit Design & Fab Magazine, Mar 14)
SEMI to Address Packaging of 450mm Wafers and Panel Scale Technologies
(TMCnet.com, Mar 14)
Heliatek starts €14 million a roll-to-roll OPV production plant
(Pv Tech, Mar 13)
Heliatek opens organic solar panel production facility
(PV Magazine, Mar 13)
SEMI to Address Packaging of 450mm Wafers and Panel Scale Technologies
(Semiconductor Packaging News, Mar 13)
SEMI Releases Policy White Paper on U.S. Solar Manufacturing
(PCB007 IConnect007, Mar 12)
Without China, the global PV market would be less advanced
(PV Magazine, Mar 12)
Chip-making equipment spend flat in 2012, says SEMI
(EE Times, Mar 12)
ASML Becomes Leading Semi Equipment Vendor
(Semiconductor Manufacturing & Design, Mar 09)
Tablets to boost semiconductor use to fourth place
(EE Times, Mar 09)
Digitimes Research: AMOLED shifts into spotlight in 2012
(Digitimes, Mar 09)
TSMC plans hiring spree in Taiwan
(Digitimes, Mar 08)
Printed and potentially printed electronics could reach $9.4 Billion in 2012
(EETE Power Management Design, Mar 08)
Hard mask development taps use of nanocrystals
(EE Times, Mar 07)
Fab Equipment Spending Growth Flat in 2012
(PCB007 IConnect007, Mar 07)
Applied Materials, IME open Singapore 3-D packaging lab
(EE Times, Mar 07)
Global January chip sales down 3%, says SIA
(Digitimes, Mar 06)
GSA concerned over WSTS, may seek sales data role
(EE Times, Mar 06)
Is grid parity "just around the corner"?
(PV Magazine, Mar 06)
Foxconn Launches CNY22bn LTPS LCD Panel Project in Chengdu
(TMCnet.com, Mar 05)
Independence Day for Globalfoundries
(Fabtech, Mar 05)
Oerlikon sells solar business
(PV Magazine, Mar 05)
ASML updates EUV progress
(Digitimes, Mar 01)
Air Products Agrees to Acquire DuPont's Stake in DuPont Air Products NanoMaterials
(Nanowerk, Mar 01)
Opinion: Did Intel just break my glasses?
(EE Times, Mar 01)
Why it’s wrong for Intel and AMD to abandon WSTS
(EE Times, Feb 29)
SEMI acquires Plastic Electronics Conference and Exhibition
(+Plastic Electronics, Feb 29)
Taiwan seeks merger with restructured Elpida
(PhysOrg.com, Feb 29)
Initiative on 450-mm moves gets Europe's full attention
(Semiconductor Packaging News, Feb 29)
Initiative on 450-mm moves gets Europe's full attention
(EE Times, Feb 28)
Intel lays out strategic mobile roadmap
(Computer World, Feb 28)
SEMI acquires Plastic Electronics for special interest play
(EE Times, Feb 28)
Solving a Spintronic Mystery: Researchers Resolve Controversy Over Gallium Manganese Arsenide That Could Boost Spintronic Performance
(Science Daily, Feb 27)
Chinese Manufacturers Cement Their Hold On Global Solar Market
(Forbes.com, Feb 27)
Researchers to develop new energy storage device based on water
(PhysOrg.com, Feb 27)
Employees, Leaders Honor late Micron CEO
(International Business Times, Feb 24)
Tool Order: Applied Materials and Novellus rewarded with further purchases from TSMC
(Fabtech, Feb 24)
N.A. Semicon Equipment Industry’s January B2B Ratio 0.95
(PCB007 IConnect007, Feb 24)
Japan Semi Gear B2B Tops 1.0 for 2d Straight Month
(Printed Circuit Design & Fab Magazine, Feb 24)
A new EU project aims to speed up the commercialisation and adoption of organic and large area electronics
(OLED-Info, Feb 24)
PV Balance of System Market to Reach $24 Billion in 2016, According to New IMS Research Report
(Solar Plaza, Feb 23)
SEMICON China to Focus on Technology Challenges and New Opportunities in Semiconductor and Emerging Markets
(TMCnet.com, Feb 23)
ISSCC: Voltage regulators stacked in 3-D
(EE Times, Feb 22)
Tiny, Implantable Medical Device Can Propel Itself Through Bloodstream
(Science Daily, Feb 22)
NREL unveils largest OPV module produced in-house
(+Plastic Electronics, Feb 22)
A New Twist On Nanowires
(Science Daily, Feb 22)
Global Industry Leaders Converge on SOLARCON China 2012
(TMCnet.com, Feb 22)
Samsung Spins Off Its Display Business, Shifts Focus From LCD to OLED
(International Business Times, Feb 20)
Applied Materials expects wafer fab equipment spending above US$30 billion
(Fabtech, Feb 20)
Transistor Made Using a Single Atom May Help Beat Moore’s Law
(Bloomberg Businessweek, Feb 20)
KLA-Tencor shipping next-node wafer inspection tools
(Semiconductor Packaging News, Feb 20)
EUV Misses 14nm Node and Now Aims for 10nm
(Semiconductor Packaging News, Feb 20)
Fundamentals: Advanced semiconductor processes
(Electronic Products Magazine, Feb 17)
"Highly competitive" pricing from Tier 2 Chinese PV module manufacturers
(PV Magazine, Feb 16)
Cymer reports major progress on EUV power source
(EE Times, Feb 16)
ISMI convenes 200mm semiconductor fab tool obsolescence forum
(Semiconductor Packaging News, Feb 16)
Tower bids to build 300-mm wafer fab in India
(EE Times, Feb 16)
Possible Micron-Elpida merger could rock DRAM market to its core, says IHS
(Digitimes, Feb 16)
Report: Chip makers closed 49 fabs in three years
(EE Times, Feb 15)
Samsung Electronics Announces Possible Spin Off of Their LCD Division
(TMCnet.com, Feb 15)
Darkhorse litho technologies stay in NGL race
(EE Times, Feb 15)
Opportunities for China's IC Supply Chain Development Showcased at Upcoming SEMICON China 2012
(TMCnet.com, Feb 15)
LED News: SemiLEDs, Intematix, Plessey, GT Advanced Technology, Rubicon
(LEDs Magazine, Feb 14)
TEL joins CEA-Leti programs on DSA, maskless litho
(EE Times, Feb 14)
Samsung Says Considering Options for LCD Business
(International Business Times, Feb 14)
Korean firms leading mobile DRAM market
(Digitimes, Feb 14)
Top R&D achievements in energy-saving lighting honored at DOE workshop
(LEDs Magazine, Feb 13)
South Korea Moves Closer to Setting Limits on Carbon Emissions
(Bloomberg Businessweek, Feb 13)
Chip stocks have room to grow
(EE Times Europe, Feb 13)
NAND flash market to expand surpassing DRAM in 2012, says IC Insights
(Digitimes, Feb 13)
Upcoming SEMI Europe Symposium to Confront IC Industry Challenges
(EMS Now, Feb 13)
IMEC announces directed self-assembly process line
(EE Times, Feb 10)
IMS Research: PV manufacturing equipment replacement cycle a US$25 billion revenue opportunity
(Pv Tech, Feb 10)
Upcoming SEMI Europe Symposium to Confront IC Industry Challenges
(Semiconductor Packaging News, Feb 10)
European research project to boost solar cell efficiency
(EE Times, Feb 10)
IMEC announces directed self-assembly process line
(EE Times, Feb 10)
IMS Research: PV manufacturing equipment replacement cycle a US$25 billion revenue opportunity
(Pv Tech, Feb 10)
Upcoming SEMI Europe Symposium to Confront IC Industry Challenges
(Semiconductor Packaging News, Feb 10)
SIL report: LED cost reduction to come from manufacturing
(LEDs Magazine, Feb 09)
Upcoming SEMI Europe Symposium to Confront IC Industry Challenges
(TMCnet.com, Feb 09)
The Semiconductor Industry Has Lost a Hero
(EMS Now, Feb 09)
The Semiconductor Industry Has Lost a Hero
(Semiconductor Packaging News, Feb 08)
Federal research lab concludes China’s costs to produce and deliver solar to US market exceed those of US producers
(PV Magazine, Feb 08)
SIA makes public technology roadmap
(EE Times, Feb 07)
Viewpoint: How will the chip wars be won? -- Part 1
(EE Times, Feb 07)
LED market grew almost 10% in 2011, with 44% growth in lighting
(LEDs Magazine, Feb 07)
Silicon Wafer Revenues Up in 2011
(TMCnet.com, Feb 07)
Plessey buys LED technology firm, aims at drastically lower HB LED costs
(EE Times Europe, Feb 07)
Semiconductor Industry Hits $299.5 Billion Sales in 2011
(PCB007 IConnect007, Feb 06)
Successful Adoption of DFM
(EE Times, Feb 06)
Q4 2011 surge in North American PV installations
(PV Magazine, Feb 06)
Micron CEO Steve Appleton dies in plan crash
(Electronics Weekly, Feb 06)
Strong semi growth - except for DRAM, says ESIA
(Electronics Weekly, Feb 03)
Collaboration Models
(Chip Design, Feb 03)
TSMC plans 3-D IC assembly launch early in 2013
(EE Times, Feb 02)
U.S., S.Korea, and Japan have 85.3% of semiconductor IC revenue share, as per a study
(Semiconductor Packaging News, Feb 02)
CEA-Leti opens 3-D IC packaging service
(EE Times, Feb 01)
Organic solar cells and OLEDs - A comparison of two competing approaches
(EE Times Europe, Feb 01)
Semiconductor industry revenue targets $323.2B in 2012
(ElectroIQ, Jan 31)
Progress in Printed Electronics: An Interview with PARC’s Janos Veres
(ElectroIQ, Jan 31)
MOCVD cools down, LED downstream processing heats up
(ElectroIQ, Jan 30)
North American Semiconductor Equipment Industry Posts December 2011 Book-to-Bill Ratio of 0.88
(EMS Now, Jan 30)
LG Display to start making OLED TV panels in July, capacity will be 48,000 units a month
(OLED-Info, Jan 27)
Fab's 'ripple effect' grows Times Union, Albany, N.Y.
(TMCnet.com, Jan 27)
TSMC returns fire over 28-nm process issues
(EE Times, Jan 26)
Physicists develop single-photon emitting light source
(Nanowerk, Jan 26)
KLA-Tencor introduces three new wafer defect inspection systems
(ElectroIQ, Jan 25)
Holst and Imec to collaborate on flexible OLEDs
(+Plastic Electronics, Jan 25)
Electronics: launch of a new offer
(PV Magazine, Jan 25)
SEMATECH and Soitec Partner to Advance Next-Generation Transistors and Metrology Techniques
(TMCnet.com, Jan 25)
Japan Manufacturing Exodus ‘Large’ Cause for Trade Concern
(Bloomberg Businessweek, Jan 25)
MEMS Industry Group Launches MEMS Executive Congress Europe
(News Blaze, Jan 25)
Soitec, Sumitomo Electric scale GaN engineered wafers to 6"
(ElectroIQ, Jan 24)
With Highest Fab Equipment Capex Forecasted for 2012, Korea is Ready for SEMICON Korea- Slated for February 7-9
(EMS Now, Jan 24)
North American Semiconductor Equipment Industry Posts December 2011 Book-to-Bill Ratio of 0.88
(TMCnet.com, Jan 24)
TI beats estimates; plans to close two fabs
(EE Times, Jan 23)
North American semiconductor equipment ends 2011 with another book-to-bill climb
(ElectroIQ, Jan 23)
Mask writer collaboration announced: IMS Nanofabrication, DNP, Intel and Photronics
(ElectroIQ, Jan 23)
Intel, Samsung, TSMC semiconductor capex in 2012 signal market dominance
(ElectroIQ, Jan 23)
Intel, Samsung 2012 Capex Budgets in a League of Their Own
(EMS Now, Jan 23)
QD Vision recipient of 2011 SEMI Award for North America
(EE Times, Jan 20)
KLA-Tencor uncrates metrology line-up for leading-edge semiconductor wafers
(ElectroIQ, Jan 20)
TSMC's 28-nm process in trouble, says analyst
(EE Times, Jan 20)
With Highest Fab Equipment Capex Forecasted for 2012, Korea is Ready for SEMICON Korea-- Slated for February 7-9
(TMCnet.com, Jan 20)
Intel says 2012 capex will top $12 billion
(EE Times, Jan 19)
Chang predicts 2% growth. Others disagree
(Electronics Weekly, Jan 19)
QD Vision Receives 2011 SEMI Award for North America for its Pioneering Quantum Dot Research
(Nanowerk, Jan 18)
US Department of Energy to invest in OLED lighting
(+Plastic Electronics, Jan 18)
QD Vision Receives 2011 SEMI Award for North America for its Pioneering Quantum Dot Research
(TMCnet.com, Jan 18)
TSMC's Chang cuts 2012 chip market growth forecast to 2%
(EE Times, Jan 18)
Germany: New proposals for solar subsidies
(PV Magazine, Jan 18)
Analyst honored by fab tool trade group
(EE Times, Jan 17)
Analyst warns of chip downturn in 2013
(EE Times, Jan 17)
ISS day 2: Cloud computing to drive 450mm, closer collaboration
(ElectroIQ, Jan 17)
Counterfeit chip R&D launched for DoD suppliers
(EE Times, Jan 17)
ISS: Top Ten Economic Trends in 2012
(ElectroIQ, Jan 17)
Samsung plans $41 billion logic, OLED investment spree
(EE Times, Jan 17)
Holst, IMEC work on flexible OLED displays
(EE Times, Jan 17)
ISS kicks off with IC industry reality talks
(ElectroIQ, Jan 16)
Organic printed electronics roadmap recognizes market entry
(ElectroIQ, Jan 16)
The Fast Track to 3D-IC Testin
(EE Times, Jan 16)
New installed wafer capacity leader: Taiwan took over in 2011
(ElectroIQ, Jan 16)
IBM reports on atomic magnetic memory
(EE Times, Jan 13)
Taiwan now the world's leading chip maker
(EE Times, Jan 13)
Cooling computer chips with interface-enhanced carbon nanotubes
(Nanowerk, Jan 13)
Solar Slump Ending, Says Axiom Analyst Who Predicted Armageddon
(Bloomberg Businessweek, Jan 12)
Packaging Community Takes on New Challenges through Industry Collaboration
(Semiconductor Packaging News, Jan 12)
Stanley Myers Named Director Emeritus of SEMI
(TMCnet.com, Jan 12)
President Obama Issues Call to Action to Invest in America at White House 'Insourcing American Jobs' Forum
(TMCnet.com, Jan 12)
SEMI names Stanley Myers a director emeritus
(ElectroIQ, Jan 11)
SEMI forms Chinese PV standards committee
(ElectroIQ, Jan 11)
Report: Chip Package Substrate Demand to Grow 5% This Year
(Printed Circuit Design & Fab Magazine Online, Jan 11)
Semicon Fab Equipment Spending to Drop 11% in 2012
(PCB007 IConnect007, Jan 11)
IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab
(TMCnet.com, Jan 11)
Not Quite The $1,000 Genome, But Maybe Close Enough
(Forbes.com, Jan 10)
CVD Equipment is Among the Companies in the Semiconductor Equipment Industry With the Highest Sales Growth (CVV, MEMS, RBCN, UTEK, ASYS)
(TMCnet.com, Jan 10)
Crystal LED, a new self-emitting LED TV technology from Sony
(OLED-Info, Jan 10)
Marvell Launches Breakthrough Smart Energy Management Platforms for Appliances and LED Lighting Solutions
(EE Times, Jan 09)
Why the semiconductor industry will rise again
(EE Times, Jan 09)
Marvell and One Laptop per Child unveil the XO 3.0 Tablet
(EE Times Europe, Jan 09)
CES 2012: Trends to Watch – Morphing, Personalization, Interfaces, LED TVs
(International Business Times, Jan 09)
Tool Order: KLA-Tencor receives multiple orders from Taiwan’s top foundries
(Semiconductor Packaging News, Jan 09)
CES: For The Chip Sector, A Focus On Ultrabooks, ARM
(Forbes.com, Jan 06)
Fab-lite exports brains, says Harvard professor
(Electronics Weekly, Jan 06)
MEMS Will Set the World on Fire
(Design News, Jan 06)
Ten Events that will Transform the Technology Industry in 2012
(EMS Now, Jan 06)
S. Korea Approves Samsung's Flash Chip Plant in China
(International Business Times, Jan 04)
LCD TV Shipment Growth to Improve in 2012, Driven by 40" and Larger Sizes
(EMS Now, Jan 04)
Intel Maintained No. 1 Rank in Chips; Samsung, Texas Instruments Follow: Gartner
(International Business Times, Jan 03)
CES 2012: 5 trends to watch
(InfoWorld, Jan 03)
Sharp, Samsung Agree on $539 Million to End Antitrust Cases
(Bloomberg Businessweek, Jan 03)
Will 22nm need a mid-node?
(Semiconductor Packaging News, Jan 03)
Graphene mixer could speed up future electronics
(EE Times Europe Analog, Jan 03)
3D integration key to 22nm semiconductor devices
(ElectroIQ, Jan 02)
20nm mask technology relies on SMO and DPT
(ElectroIQ, Jan 02)
SIL 2012 Preview #4: Solid-State Lighting Investor Forum
(LEDs Magazine, Jan 02)
CES 2012: Top New Technology Trends to Look For
(International Business Times, Jan 02)
