Wire Bonding Training

Materials Science of Wire Bonding & Wire Bond Reliability
Plaza Royale Oriental Shanghai, Shanghai, China(上海兴荣豪廷大酒店)
March 17, 2010

Organizers: World Gold Council and SEMI
Date & Time: 09:00 – 16:00, March 17 (Wednesday)

Training Outline:

	1.	Wire Manufacturing Process a. Process Flow b. Casting, Doping & Solidification c. Wire Drawing d. Annealing e. Composite & Coated Wires
	2.	Wire & Free Air Ball Characteristics a. Gold, Copper and Aluminium Wires b. Wire Composition c. Finished Wire Properties & Microstructure d. Free Air Balls an the Heat Affected Zone e. Alternative Wires
	3.	Ball Bond Formation a. Plastic Deformation and Ultrasound b. Phase Formation & Ultrasound c. Intermetallic Coverage d. Alternative Bond Pad Metallization
	4.	2nd Bond Formation a. Plastic Deformation of the 2nd Bond b. Tail Bond Termination
	5.	Looping a. HAZ and Looping b. Loop Profiling and Sway c. Mould Sweep
	6.	Intermetallic Growth & Reliability a. Concepts of Interdiffusion and Phase Growth b. Intermetallic Growth in Au, Cu and Composite Wire Ball Bonds on Al Bond Pads c. Phase Growth & Reliability of Au and Cu Wires with Alternative Bond Pad Metallization d. Effects of Electric Current on Intermetallic Growth

Tutor: Christopher Breach

Christopher is currently owns and manages ProMat Consultants, a materials science consulting firm based in Singapore that provides process and materials science expertise for industry.
Christopher’s expertise spans a broad range of materials science, including polymer physics and physical chemistry, materials characterization, materials science and engineering in microelectronics packaging, intermetallics and interdiffusion, bonding wire design and statistical design of experiments and data analysis.
He has held various management and technical positions in industry including most recently Vice President, Wire Bond Strategic Business Unit, Esec Singapore; Director of Global Field Service Operations for wafer & package inspection equipment at RVSI LLC; Director of Materials R&D / Product Development for Kulicke & Soffa bonding wire; Project & Development Manager at Hana Microelectronics Thailand. He was a research scientist for Singapore Institute of Manufacturing Technology researching inkjet/microjet process applications and materials development in flexible and macro-electronics and providing expertise in a wide range of physical and chemical characterization techniques.
Christopher is a Chartered Scientist, Chartered Physicist, Professional Member of the Institute of Physics, member of The Institute of Electrical and Electronics Engineers (IEEE) and the Materials Research Society (MRS). He earned his PhD in physics & physical chemistry of polymers (sponsored by the Defence Research Agency) from Brunel University, London. His postdoctoral research was sponsored by ICI at the Cavendish Laboratory, University of Cambridge on welding and interdiffusion in polymers and the physics of bi-material fracture. He is a frequent reviewer for Microelectronics Reliability and the Journal of Materials Science.

Who Should Attend:

Technical managers and engineers at semiconductor packaging companies
Technical managers and engineers at semiconductor equipment and material companies
Professors and research engineers at universities and research institutes

Registration:
RMB 1500 per person
RMB 500 per person for CSTIC registered speakers and attendees

Please pay by credit card or wire transfer by filling the following form and fax back to : +86.21.5045.0256
Registration Form(PDF 156KB)

Contact:
Lisa Lin
SEMI China
Tel: 86.21.5027.0909 ext 255
E-mail: program@semi.org.cn